Electromigration And IR Drop At Advanced Nodes


Manufacturing chips at 3nm and below is a challenge, but it's only part of the problem. Designing chips that can be manufactured and will actually work is potentially an even bigger problem. There is more data to sift through for place-and-route, less margin to pad a design, and there are more physical effects to contend with as transistors get taller, density increases, and chips age. Jeff Wil... » read more

What Does Shift Left With Calibre Mean For IC Designers


Driven by the world’s seemingly insatiable demand for electronics that constantly do more faster, integrated circuit (IC) design companies are continuously seeking ways to profitably deliver products with more functionality, reliability, and performance while reducing time-to-market. To accomplish this, a well-planned shift left strategy can free up critical time and resources in delivery sch... » read more

The Four Foundational Pillars Of Calibre Shift Left Solutions For IC Design And Implementation Flows


As the semiconductor industry approaches a new era of digital transformation, design companies everywhere are turning to shift left strategies to address challenges that reduce design cycles while maximizing productivity, optimizing resource efficiency, ensuring design quality, and accelerating time to market. To overcome these challenges in IC design, Calibre shift left technologies include to... » read more

Optimizing Tool Integration Is Essential To Design Success


By James Paris and Armen Asatryan The relationship between a place and route (P&R) application and the collection of system-on-chip (SoC) design implementation, analysis, and verification methodologies and tools has always been very much a two-way street. The P&R system is the base, if you will, of design implementation—it takes the virtual and makes it physical. However, it is use... » read more

Design For Manufacturing Best Practices


Manufacturing issues are one of the top reasons that we see warranty returns and loss of market share in the electronics industry. Issues like supply chain failures and printed circuit board assembly (PCBA) production challenges related to design can lead to irreparable damage to a brand’s reputation. It is therefore critical that companies have a design for manufacturability (DfM) protocol i... » read more

Much Smarter Manufacturing


Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

Manufacturing Speed And Agility Enabled By Turnkey HPC Solutions


Manufacturers face growing competition as new players enter the global market all the time. To stay ahead of rivals, they increasingly rely on digital modeling and simulation tools for product design, analysis and testing with the help of HPC and CAE. So how is HPC enabling innovation for manufacturers from small to large? This white paper covers: Using HPC to accelerate product develo... » read more

Fast LFD Flows With Pattern Matching And Machine Learning Can Deliver Higher-Yielding Designs Faster


By Wael ElManhawy and Joe Kwan A lithographic (litho) hotspot is a defect on a wafer that is created during manufacturing by a combination of systematic process variation and resolution enhancement technology (RET) limitations. Litho hotspots typically represent severe yield detractors, so detecting and eliminating potential litho hotspots prior to manufacturing is crucial to achieving a com... » read more

Week in Review: IoT, Security, Auto


Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

Mashup At 7nm


The merger of two standards organizations typically falls well below the radar of most engineers, but folding the ESD Alliance (formerly known as the EDA Consortium) into SEMI is a different kind of deal. Ever since the introduction of finFETs and multiple patterning, EDA tools have become an integral part of the development of new manufacturing processes. Without those tools, there is no po... » read more

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