tag: DFM

DTCO/STCO Create Path For Faster Yield Ramps
By Laura Peters - 12 Mar, 2024 - Comments: 0

Higher density in planar SoCs and advanced packages, coupled with more complex interactions and dependencies between various components, are permitting systematic defects to escape traditional detection methods. These issues increasingly are not detected until the chips reach high-volume manufacturing, slowing the yield ramp and bumping up costs. To combat these problems, IDMs and systems co... » read more

The Four Foundational Pillars Of Calibre Shift Left Solutions For IC Design And Implementation Flows
By Siemens EDA - 23 Aug, 2023 - Comments: 0

As the semiconductor industry approaches a new era of digital transformation, design companies everywhere are turning to shift left strategies to address challenges that reduce design cycles while maximizing productivity, optimizing resource efficiency, ensuring design quality, and accelerating time to market. To overcome these challenges in IC design, Calibre shift left technologies include to... » read more

Calibre DesignEnhancer Design-Stage Layout Modification Improves Power Management Faster And Earlier
By Siemens EDA - 19 Jul, 2023 - Comments: 0

The faster a design can progress from implementation to signoff verification, the better the chances are of meeting tapeout schedules. The Calibre DesignEnhancer platform offers P&R and custom/analog design teams a fast, integrated environment for implementing Calibre-clean design modifications to reduce IR drop and EM and prepare for physical verification. Not only can designers reduce EM and ... » read more

Shift Left With Calibre To Optimize IC Design Flow Productivity, Design Quality, And Time To Market
By Siemens EDA - 21 Jun, 2023 - Comments: 0

Every IC designer strives to create a “clean,” or error-free, cell, block, chiplet, SoC, or 3DIC assembly before passing their work downstream for full sign-off verification. However, waiting until sign-off verification to find out how well you did is probably the least efficient approach to achieving production-ready layouts, impacting engineer productivity, project schedules, and hardware... » read more

Pre-Layout, Post-Layout Circuit Reliability
By Siemens EDA - 26 Apr, 2023 - Comments: 0

With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff verification to check design reliability is no longer practical for design teams. Designers must now apply reliability verification checks throughout the design flow, from intellectual property (IP) level to full-chip level, to ensure they meet tapeout schedules while confirming design reliability... » read more

What Data Center Chipmakers Can Learn From Automotive
By Anne Meixner - 11 Apr, 2023 - Comments: 2

Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, but systems companies are looking to emulate that level of quality for their data center SoCs. Building to that quality level is more expensive up front, although ultimately it can save costs versus having to ... » read more

Speed Up Early Design Rule Exploration And Physical Verification
By Siemens EDA - 21 Dec, 2022 - Comments: 0

Ensuring that early-stage IC design physical verification actually enhances IC design and verification productivity means giving engineers the ability to focus on those errors that are both valid and critical in early-stage designs. The Calibre nmDRC Recon functionality provides selective DRC of early-stage designs that focuses on real, relevant errors, ignoring rule checks that generate meanin... » read more

Dynamic Flash Memory with Dual Gate Surrounding Gate Transistor (SGT)
By Technical Paper Link - 03 Sep, 2021 - Comments: 0

Abstract: "This paper proposes an ultra-scaled memory device, called `Dynamic Flash Memory (DFM)'. With a dual-gate Surrounding Gate Transistor (SGT), a capacitorless 4F2 cell can be achieved. Similar to DRAM [1], refresh is needed, but high speed block refresh can improve the duty ratio. Analogous to Flash [2], three fundamental operations of “0” Erase, “1” Program, and Read are nee... » read more

Modeling Chips From Atoms To Systems
By Ann Mutschler - 26 Aug, 2021 - Comments: 1

Complexity in hardware design is spilling over to other disciplines, including software, manufacturing, and new materials, creating issues for how to model more data at multiple abstraction levels. Challenges are growing around which abstraction level to use for a particular stage of the design, when to use it, and which data to include. Those decisions are becoming more difficult at each ne... » read more

Optimizing Tool Integration Is Essential To Design Success
By James Paris - 22 Dec, 2020 - Comments: 0

By James Paris and Armen Asatryan The relationship between a place and route (P&R) application and the collection of system-on-chip (SoC) design implementation, analysis, and verification methodologies and tools has always been very much a two-way street. The P&R system is the base, if you will, of design implementation—it takes the virtual and makes it physical. However, it is use... » read more

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