Context-Aware Analysis Can Automatically Protect Critical Nets And Devices During Fill Insertion

By Dina Medhat - 27 Jul, 2023 - Comments: 0

Context-aware physical verification (PV) is a relatively new addition to traditional PV flows, but it has quickly become a critical and essential technology that addresses the increasing complexity of geometrical checks used in both established and emerging integrated circuit (IC) technologies. Traditional electronic design automation (EDA) verification tools handle either the physical verifica... » read more

Speed Up Early Design Rule Exploration And Physical Verification

By Siemens EDA - 21 Dec, 2022 - Comments: 0

Ensuring that early-stage IC design physical verification actually enhances IC design and verification productivity means giving engineers the ability to focus on those errors that are both valid and critical in early-stage designs. The Calibre nmDRC Recon functionality provides selective DRC of early-stage designs that focuses on real, relevant errors, ignoring rule checks that generate meanin... » read more

Earlier SoC Design Exploration And Verification Gets Better Designs To Tapeout Faster

By Nermeen Hossam - 25 Aug, 2022 - Comments: 0

By Nermeen Hossam and John Ferguson Between the complexity of advanced node design verification and the competition to be first to the market, system-on-chip (SoC) designers no longer have the luxury of waiting until each sub-block of a chip is DRC-clean to start their chip assembly and verification. Today’s SoC designers typically start chip integration in parallel with block development.... » read more

IC Reliability Burden Shifts Left

By Ann Mutschler - 23 Jun, 2022 - Comments: 0

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

Reliable DRC Voltage Text Annotation Means Faster And More Accurate DRC Verification

By Abdellah Bakhali - 14 Apr, 2022 - Comments: 0

As the potential for complex interactions between voltage domains grows significantly with the increase in design density at each new process node, the complexity of spacing checks in design rule checking (DRC) also increases. To minimize these types of risk, many simple spacing checks have evolved to become voltage-aware DRC (VA-DRC) checks that incorporate voltage values to determine the requ... » read more

Automated DRC Voltage Annotation Provides Faster And More Accurate Verification For Voltage-Aware Spacing Rules

By Siemens EDA - 13 Apr, 2022 - Comments: 0

Accurate and repeatable reliability verification is now essential for both advanced node designs and the increasingly complex products being produced at established nodes. To ensure compliance with all process, reliability, and power management requirements, voltage-aware DRC applies variable spacing requirements, based on either the absolute voltage or delta voltage values, to accurately evalu... » read more

Challenges With Stacking Memory On Logic

By Ed Sperling - 22 Dec, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Batch Filters: A Better, Faster Way To Filter Large DRC Results Databases

By Siemens EDA - 22 Nov, 2021 - Comments: 0

Reviewing massive DRC results databases (RDBs) can be a time-consuming stage in traditional debug flows, due primarily to the loading, filtering, and display times associated with these large datasets. Finding the most effective approach to filtering results data is important to optimize both results debug time and resource usage. While smaller databases that load quickly in GUI applications ca... » read more

Microchip Sees Significant Productivity Gains In Mature-Node Custom IC Design With In-Design Signoff DRC

By Siemens EDA - 27 Oct, 2021 - Comments: 0

Microsemi pioneered the design of innovative chips that are used for multiple purposes across a variety of industries, using both mature and advanced process nodes. In mature node custom design implementation, layout designers still spend a significant amount of their valuable time fixing DRC errors—time that could be more beneficially spent ensuring their designs meet their PPA goals. By rep... » read more

In-Design Signoff DRC For Productivity Improvement

By Srinivas Velivala - 26 Aug, 2021 - Comments: 0

Microsemi, a wholly-owned subsidiary of Microchip Technology, produces a portfolio of semiconductor and system solutions for communications, defense and security, aerospace, and industrial markets. In addition to high-performance and radiation-hardened analog/mixed-signal integrated circuits, FPGAs, SoCs and ASICs, they also design power management products, timing and synchronization devices, ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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