tag: eBeam Initiative

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Oct, 2020 - Comments: 0

Chipmakers AMD and Xilinx have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion. With the proposed deal, AMD will enter the FPGA business, putting it further in competition with Intel. The transaction has been unanimously approved by the AMD and Xilinx boards. The transaction is expected to close by the end of calendar year 2021. U... » read more

Mask/Lithography Issues For Mature Nodes
By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

2019-2020 Mask Maker Survey Results
By eBeam Initiative - 21 Oct, 2020 - Comments: 0

The survey results of the 2019-2020 Mask Maker Survey from the eBeam Initiative. • Multi-Beam and EUV Trends Becoming Visible • 558,834 masks reported by 10 different companies than last year • Masks written with Multi-Beam Mask Writers more than doubled • EUV mask yield reported at 91% • MPC usage increasing at leading edge nodes Click here to see the presentation. » read more

eBeam Initiative Surveys Report Upbeat Photomask Market Outlook
By Jan Willis - 05 Oct, 2020 - Comments: 0

Every year, the eBeam Initiative conducts surveys that provide valuable insight into the key trends that are shaping the semiconductor industry. This year, industry luminaries representing 42 companies from across the semiconductor ecosystem participated in the 2020 eBeam Initiative Luminaries survey. 89% of respondents to the survey predict that photomask (mask) revenues in 2020 will stay the ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Oct, 2020 - Comments: 0

Chipmakers and OEMs NXP has announced the grand opening of its 150mm (6-inch) RF gallium nitride (GaN) fab in Chandler, Ariz. This is said to be the most advanced fab dedicated to 5G RF power amplifiers in the United States. NXP’s new Chandler-based GaN fab is qualified now, with initial products ramping in the market and expected to reach full capacity by the end of 2020. GaN, a III-V techn... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Sep, 2020 - Comments: 0

Top stories Here's the latest from Reuters: ''The United States has imposed restrictions on exports to China’s biggest chip maker SMIC after concluding there is an 'unacceptable risk' equipment supplied to it could be used for military purposes." What does this all mean? “The press has reported that on Friday, the U.S. Department of Commerce placed restrictions on China's largest semicondu... » read more

Survey: 2019 eBeam Initiative Perceptions Survey Results
By eBeam Initiative - 16 Sep, 2020 - Comments: 0

Results of the 2020 eBeam Initiative Perceptions survey, now called the Luminaries survey, will be made available starting on September 22 here: Meanwhile, here is the 8th Annual Perceptions Survey – 2019 (July). 68 luminaries across 42 different companies participated. Some highlights: Deep learning impact predicted by 2020: 76% of the respondents say it’s somewhat to very lik... » read more

China Speeds Up Advanced Chip Development
By Mark LaPedus - 22 Jun, 2020 - Comments: 18

China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient. The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no pres... » read more

Enabling Curvilinear Masks
By eBeam Initiative - 18 Jun, 2020 - Comments: 0

This talk by Leo Pang, Chief Product Officer of D2S, takes a look at a unique GPU-accelerated approach to curvilinear inverse lithography technology (ILT) and introduces mask-wafer co-optimization (MWCO) that enables writing curvilinear ILT for 193i on VSB or multi-beam machines in 12 hours. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Feb, 2020 - Comments: 2

SPIE At the SPIE Advanced Lithography conference, Lam Research has introduced a new dry resist technology for extreme ultraviolet (EUV) lithography. Dry resist technology is a new approach to deposit and develop EUV resists. It is a dry deposition technique with alternate compositions and mechanisms. By combining Lam’s deposition and etch process expertise with partnerships with ASML a... » read more

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