Analog IP Reuse


Analog integrated circuit IP is essential to how microelectronic circuits and systems interact with the environment. It enables things like signal conversion, stable power supply, and communication in state-of-the-art devices. However, designing these critical components – even though they are often a small part of complex chips – is very costly and risk-prone. And in today’s analog field... » read more

DAC/Semicon West Wednesday


Trade restrictions against China were a regular topic of discussion at both DAC and Semicon West this week. Five Chinese startups exhibited prominently at this week's Design Automation Conference, in the wake of increasingly restrictive trade regulations that limit the sale of U.S. and European EDA tools used to develop advanced semiconductors. Most attendees interviewed said privately th... » read more

EDA, IP Fundamentals Shift As Market Soars


EDA tools and IP continued their double-digit growth trajectory this year, despite a downturn in consumer electronics and a continued shortage of key components that took a large bite out of the semiconductor market as a whole. A just-released report from the ESD Alliance showed a 12% increase in revenue for Q1, increasing to $3.95 billion compared with $3.53 billion in the same period in 20... » read more

Changes In Memory Design


An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Challenges Grow For Data Management And Sharing In EDA


Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

Not All There: Heterogeneous Multiprocessor Design Tools


The design, implementation, and programming of multicore heterogeneous systems is becoming more common, often driven by the software workloads, but the tooling to help optimize the processors, interconnect, and memory are disjointed. Over the past few years, many tools have emerged that help with the definition and implementation of a single processor, optimized for a given set of software. ... » read more

Revolutionizing Product Development And User Experience: The Transformative Power Of Generative AI


Generative AI has become a prominent and versatile solution across various domains, including chip and system development. Its progress and impact have outpaced many other technological advancements, significantly benefiting numerous areas. In the semiconductor industry, EDA tools with generative AI have already established their position by offering unparalleled optimization capabilities. Thes... » read more

L31 Embedded Core Extensions For Wireless And Connectivity


5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G), which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable multip... » read more

Smart Manufacturing Makes Gains In Chip Industry


Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

ESD Co-Design For High-Speed SerDeS In FinFET Technologies


An electronic device is susceptible to Electrostatic Discharge (ESD) damage during its entire life cycle, including the phase from the completion of the silicon wafer processing to when the device (die) is assembled in the system. To avoid yield loss due to ESD damage during this early phase, on-chip ESD protection measures are applied to provide a certain degree of ESD robustness. The componen... » read more

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