New Reliability Issues


By Arvind Shanmugavel Reliability of ICs is a topic of growing concern with every technology node migration. With the onset of the 20nm process node from different foundries, reliability verification has taken center stage in design kits—and for good reason. Reliability margins have continued to decrease and have reached an inflection point at the 20nm node. The design and EDA communities ha... » read more

Tech Talk: Power Issues Ahead


Aveek Sarkar, vice president of technology and support at ANSYS Apache, talks with Low-Power Engineering about growing concerns over electrostatic discharge, electromigration, the impact of stacked die, and the need for power and thermal models. [youtube vid=-7TtszsuZP0] » read more

Old Problem, New Solutions


By Ann Steffora Mutschler Electromigration (EM) and electrostatic discharge (ESD) may not be new, but design design sophistication and tiny wires are demanding that engineering teams take a fresh look and utilize new tools to lesson the impacts of damaging electrical events. “These are certainly not new phenomenon,” said Carey Robertson, director of product marketing for Calibre at Ment... » read more

No More Netlist Hacking


By Ann Steffora Mutschler Prior to availability of advanced physical verification tools, it was not uncommon for engineering teams to hack netlists. It sounds very clandestine, but was done out of the need to get detailed information on particular areas of the chip suspected to be a problem. Performing electrical rules checks (ERC) to improve the correctness and reliability of IC designs b... » read more

Changes In The Ecosystem


By Ed Sperling For the better part of two decades, semiconductor companies have been talking about ecosystems mostly for marketing and economic reasons. They’re now talking thinking about ecosystems for complex technology reasons that involve integrated models for power, transactions and manufacturability. In the late 1990s, IBM began assembling its own loose ecosystem as a way of shieldi... » read more

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