Tech Talk: Power Issues Ahead

Apache Design’s Aveek Sarkar talks about electromigration, ESD, and the power and thermal challenges ahead in stacked die and at 20nm and beyond.

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Aveek Sarkar, vice president of technology and support at ANSYS Apache, talks with Low-Power Engineering about growing concerns over electrostatic discharge, electromigration, the impact of stacked die, and the need for power and thermal models.