Suppressing Stochastic Interaction To Improve EUV Lithography


Authors Zhimin Zhu Sr., Joyce Lowes, Shawn Ye, Zhiqiang Fan, and Tim Limmer of Brewer Science, Inc. (United States) used Stochastic Area Thickness (SAT) and Dynamic Stochastic Area Thickness (DSAT) to evaluate the stochastic interactions. High optical foot exposure is proposed instead of conventional low substrate reflectivity to reduce SAT. Adhesion control by acid/quencher loading is proposed... » read more

Attenuated Phase Shift Masks (attPSM) For EUV (Fraunhofer IISB)


New research paper titled "Attenuated phase shift masks: a wild card resolution enhancement for extreme ultraviolet lithography?," from researchers at Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany). Aim: "We review published research on attenuated phase shift masks (attPSM) for EUV with special emphasis on modeling and fundamental understanding of the ... » read more

The Changing Mask Landscape


Semiconductor photomasks have undergone some major technology changes in the past few years after relatively minor changes for many years. New technologies such as multi-beam mask writers and extreme ultraviolet (EUV) lithography are major breakthroughs as they ramp into high-volume manufacturing. A new trend related to these technologies is the use of curvilinear features on photomasks. Aki... » read more

ASD process that was performed in situ on the etch chamber


New research paper entitled "Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement" from TEL Technology Center, Americas and IBM Research. Abstract: "Extreme ultraviolet (EUV) lithography has overcome significant challenges to become an essential enabler to the logic scaling roadmap. However, it remains limited by stocha... » read more

Photomask Shortages Grow At Mature Nodes


A surge in demand for chips at mature nodes, coupled with aging photomask-making equipment at those geometries, are causing significant concern across the supply chain. These issues began to surface only recently, but they are particularly worrisome for photomasks, which are critical for chip production. Manufacturing capacity is especially tight for photomasks at 28nm and above, driving up ... » read more

Big Changes In Materials And Processes For IC Manufacturing


Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

Source performance metrics for EUV mask inspection


Abstract "Rules are derived to obtain specifications on radiance, power, lifetime, and cleanliness of the source for an actinic patterned mask inspection system. We focus on the physical processes and technological aspects governing the requirements of radiation sources for reticle inspection. We discuss differences and similarities to scanner with respect to magnification, system etendue, a... » read more

Strategies For Faster Yield Ramps On 5nm Chips


Leading chipmakers TSMC and Samsung are producing 5nm devices in high volume production and TSMC is forging ahead with plans for first 3nm silicon by year end. But to meet such aggressive targets, engineers must identify defects and ramp yield faster than before. Getting a handle on EUV stochastic defects — non-repeating patterning defects such as microbridges, broken lines, or missing con... » read more

Photomask Challenges At 3nm And Beyond


Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Week In Review: Manufacturing, Test


Fab tools A fire broke out this week within ASML’s factory in Berlin, Germany. The fire was quickly extinguished and no one was injured during this incident. The factory manufactures components for ASML’s lithography systems, including wafer tables and clamps, reticle chucks and mirror blocks. The fire took place on Jan. 3. On Jan. 7, ASML provided an update. "The manufacturing of DUV c... » read more

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