tag: failure analysis

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more

Next Steps For Improving Yield
By Laura Peters - 08 Nov, 2022 - Comments: 0

Chipmakers are ramping new tools and methodologies to achieve sufficient yield faster, despite smaller device dimensions, a growing number of systematic defects, immense data volumes, and massive competitive pressure. Whether a 3nm process is ramping, or a 28nm process is being tuned, the focus is on reducing defectivity. The challenge is to rapidly identify indicators that can improve yield... » read more

Better, Faster, And More Efficient Verification With The Power Of AI
By Synopsys - 07 Sep, 2022 - Comments: 0

Verification is often the most challenging part of the chip development process. Verification engineers have to balance quality of results (QOR) with time to results (TTR) and cost of results (COR). AI and ML technologies can play a significant part in increasing QOR, speeding up TTR, and reducing COR. This white paper outlines some of the major challenges for verification, describes how AI pro... » read more

IC Reliability Burden Shifts Left
By Ann Mutschler - 23 Jun, 2022 - Comments: 0

Chip reliability is coming under much tighter scrutiny as IC-driven systems take on increasingly critical and complex roles. So whether it's a stray alpha particle that flips a memory bit, or some long-dormant software bugs or latent hardware defects that suddenly cause problems, it's now up to the chip industry to prevent these problems in the first place, and solve them when they do arise. ... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Autoencoder-Based Characterisation Of Passive IEEE 802.11 Link Level Measurements
By Fraunhofer IIS/EAS - 10 Nov, 2021 - Comments: 0

Wireless networks are indispensable in today’s industrial manufacturing and automation. Due to harsh signal propagation conditions as well as co-existing wireless networks, transmission failures resulting in severe application malfunctions are often difficult to diagnose. Remote wireless monitoring systems are extremely useful tools for troubleshooting such failures.However, the completeness ... » read more

How To Identify Common Electronic Failures
By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

Industry 4.0 And The Rise Of QPaaS
By Optimal Plus - 10 Nov, 2020 - Comments: 0

McKinsey & Company frames this shift as a matter of moving the industry from its current approach of “firefighting” – responding to failures and vulnerabilities after they’re brought to OEMs’ attention – toward proactively preventing such episodes in the first place. How can the industry achieve this objective? By embracing quality protection as a service (QPaaS) — an approach... » read more

Dependent Failure Analysis For Safety-Critical IP And SoCs
By Shivakumar Chonnad - 02 Nov, 2020 - Comments: 0

By Shivakumar Chonnad, Radu Iacob, and Vladimir Litovtchenko Due to the increased complexity in safety-critical system hardware, software, and mechatronics, the functional safety development process must address systematic and random hardware failures. Numerous safety-related activities are performed during safety-critical IP and SoC developments, as part of the safety lifecycle, from produc... » read more

Failure Analysis Becoming Critical To Reliability
By Ed Sperling - 11 Feb, 2020 - Comments: 0

Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

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