tag: finFETs

New Reliability Issues Emerge
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ed Sperling Most consumers define reliability by whether a device turns on and works as planned, but the term is becoming harder to define as complexity increases and systems are interconnected. Adding more functionality in less space has made it more difficult to build complex chips, and it has made it more difficult to prevent problems in those chips. Verification coverage is a persist... » read more

Experts At The Table: Changes In The Ecosystem
By Ed Sperling - 20 Jun, 2013 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Michael Buehler-Garcia, director of design solutions marketing at Mentor Graphics; Seow Yin Lim, group director for marketing at Cadence; Kevin Kranen, director of strategic alliances at Synopsys, and Tom Quan, director at TSMC. What follows are excerpts of that conversation. SMD: What’s changing in the ecosystem and ho... » read more

Marching Orders
By Ed Sperling - 20 Jun, 2013 - Comments: 0

Reports back from the front lines of Moore’s Law are rather consistent—14nm and 16nm finFETs are do-able, but they’re not easy to design, verify or manufacture. In fact, the only high-volume source of production-proven finFETs at this point is Intel, which is turning them out at 22nm. A number of issues are cropping up at the most advanced nodes, and while each is ultimately solvable, ... » read more

The Week In Review: June 7
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling For all the hesitation about moving the Design Automation Conference to Austin, it turns out that Austin has a lot of hardware engineers. In fact they flooded into the conference, turning it into one of the most successful in recent years and setting new records in multiple areas. Even Texas Gov. Rick Perry showed up to see what all the fuss was about. Mentor Graphics added c... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 07 Jun, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design ... » read more

Scaling The Lowly SRAM
By Mark LaPedus - 05 Jun, 2013 - Comments: 0

By Mark LaPedus Chipmakers face a multitude of challenges at the 20nm logic node and beyond, including the task of cramming more functions on the same chip without compromising on power and performance. There is one major challenge that is often overlooked in the equation—scaling the lowly static RAM (SRAM). In one key application, SRAM is the component used to make on-chip cache memories... » read more

Tech Talk: FinFETs, FD-SOI And The Future Of SoC Design
By Ed Sperling - 04 Jun, 2013 - Comments: 0

Mary Ann White, marketing manager for Synopsys' Galaxy Implementation Platform, talks with Low-Power/High-Performance Engineering about new opportunities to reduce power and improve performance, and where the pain points will be. [youtube vid=kuJdcHIRxfU] » read more

The Week In Review: May 31
By Ed Sperling - 31 May, 2013 - Comments: 0

By Ed Sperling Mentor Graphics and GlobalFoundries teamed up to deliver 20nm design kits that include Mentor’s place and route tool, including verification and conflict resolution engines for double-patterning violations. The 20nm process is used for GlobalFoundries’ 14nm finFETs. Mentor also received 16nm finFET certification from TSMC for the same tools plus its physical verification pl... » read more

FinFET Technology
By Various Writers - 30 May, 2013 - Comments: 0

This white paper discusses the major challenges with FinFETs and how TSMC has been collaborating with Synopsys, one of their ecosystem partners, to deliver a complete solution. Key elements of this solution include comprehensive FinFET profiling without impact to design tool runtime and proven, verified IP availability. The TSMC 16-nm FinFET solution will ensure mutual customers swiftly move to... » read more

Bigger Wafers, Bigger Risk
By Ed Sperling - 16 May, 2013 - Comments: 0

At 22/20/16/14nm the semiconductor industry is experiencing a rather new twist on Moore’s Law. Smaller, as in smaller feature sizes, is no longer assumed to be cheaper—or at least not for everyone. In fact, the cost per transistor for the first time in more than half a century could rise in some cases. Whether this outlook improves as the semiconductor industry gains more experience wit... » read more

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