tag: Fraunhofer

Brute-Force Analysis Not Keeping Up With IC Complexity
By Brian Bailey - 24 Nov, 2020 - Comments: 0

Much of the current design and verification flow was built on brute force analysis, a simple and direct approach. But that approach rarely scales, and as designs become larger and the number of interdependencies increases, ensuring the design always operates within spec is becoming a monumental task. Unless design teams want to keep adding increasing amounts of margin, they have to locate th... » read more

Electronics For Quantum Communications
By Andy Heinig - 12 Nov, 2020 - Comments: 1

Our secure digital communications so far have functioned on the principle of key-based encryption. This involves generating a key of appropriate length, which is then used to encrypt the data. Because distributing the keys is difficult, the keys are reused rather than regularly generating new ones. The regular use of the keys opens up the encryption process to attacks by mathematical methods... » read more

Dealing With Sub-Threshold Variation
By Bryon Moyer - 12 Nov, 2020 - Comments: 0

Chipmakers are pushing into sub-threshold operation in an effort to prolong battery life and reduce energy costs, adding a whole new set of challenges for design teams. While process and environmental variation long have been concerns for advanced silicon process nodes, most designs operate in the standard “super-threshold” regime. Sub-threshold designs, in contrast, have unique variatio... » read more

Artificial Intelligence For Sustainable And Energy Efficient Buildings
By Fraunhofer IIS/EAS - 11 Nov, 2020 - Comments: 0

According to the goals of Europe’s green deal missions, the continent strives for becoming carbon neutral by 2050. Since buildings are a major contributor to the overall consumption of energy, improving their energy efficiency can be a key to a more sustainable and greener Europe. On the way towards zero-emission buildings, several challenges have to be met: In modern energy systems, several ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 06 Nov, 2020 - Comments: 0

Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Oct, 2020 - Comments: 0

Automotive, automation General Motors is planning a third electric-vehicle plant. The former Saturn factory will make first fully electric Cadillac, in the former Saturn assembly line. Tesla is allowing some customers to beta test its Full Self-Driving (FSD), according to The Verge. The company pushed the software update to some early access customers to do some real world beta test. Some o... » read more

Manufacturing Bits: Oct. 6
By Mark LaPedus - 06 Oct, 2020 - Comments: 0

High-NA EUV mask materials A team of researchers have presented a new paper on the tradeoffs of photomask absorber materials for high-NA extreme ultraviolet (EUV) lithography. In the paper, researchers concluded that the industry will likely require an alternative mask absorber stack for high-numerical aperture (high-NA) EUV lithography. Fraunhofer, Imec, ASML and Zeiss contributed to the... » read more

Analog Chip Layout: Creativity Vs. Deadlines
By Benjamin Prautsch - 10 Sep, 2020 - Comments: 0

The entire design of integrated circuits, from the specification onward, depends on successful validation by measurement of microchips. One key milestone in this process is the completion of the layout. However, the path to reach this point can be quite difficult as many iterations are usually required. It includes: Iterations with the customer to finalize the specification. Iteratio... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Mission Profiles In The Automotive Development Process
By Christoph Sohrmann - 13 Aug, 2020 - Comments: 0

The automotive industry's roadmap for the coming years is e-mobility and autonomous driving. Its implementation is likely to bring about changes on a par with the invention of the automobile itself. While the motor vehicle used to be primarily a mechanical product, it is now an entirely electronic system. Many of the new functions increase the safety of the driver and other road users, and t... » read more

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