tag: GlobalFoundries

3D IC Supply Chain: Still Under Construction
By Barbara Jorgensen - 25 Jul, 2013 - Comments: 1

By Barbara Jorgensen and Ed Sperling Stacked die, which promise high levels of integration, a tiny footprint, energy conservation and blinding speed, still have some big hurdles to overcome. Cost, packaging and manufacturability continue to make steady progress, with test chips being produced by all of the major foundries. But in a disaggregated ecosystem, the supply chain remains a big st... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

Experts At The Table: 450mm Fab And Facilities Challenges
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab S... » read more

Foundries Eye 300mm Analog Fabs
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

450mm: Out Of Sync
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus The IC industry has been talking about it for ages, but vendors are finally coming to terms with a monumental shift in the business. The vast changes involve a pending and critical juncture, where the 450mm wafer size transition, new device architectures and other technologies will likely converge at or near the same time. In one possible scenario, 450mm fabs are projected ... » read more

MEMS Foundries Play Waiting Game
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus For years, the foundries in the microelectromechanical systems (MEMS) business have been patiently waiting for the MEMS integrated device manufacturers (IDMs) to outsource some or all of their production. The MEMS foundries are still waiting for that development. Because MEMS are custom devices tuned to a proprietary process and toolset, IDMs still prefer to use their own f... » read more

GloFo Says 28nm FD-SOI Die Cost Much Less Than 28nm Bulk HPP
By Various Writers - 17 Jul, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ According to Shigeru Shimauchi, Country Manager, GlobalFoundries Japan, for the same level of performance, the die cost for 28nm FD-SOI will be substantially less than for 28nm bulk HPP (“high performance-plus”). Specifically, to get a 30%  increase in performance over 28nm bulk LPS PolySiON, HPP increases die ... » read more

Mixed Signals
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

The Week In Review: July 8
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

Foundry Talk
By Ed Sperling - 07 Jul, 2013 - Comments: 0

GlobalFoundries CEO Ajit Manocha sounds off on Foundry 2.0, 450mm wafers, lithography challenges, stacked die, the Internet of Things and the rush to the next process node. [youtube vid=WfjtlZkCi0w] » read more

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