tag: GlobalFoundries

RF SOI Market Heats Up
By Mark LaPedus - 29 Oct, 2013 - Comments: 0

GlobalFoundries has entered the radio-frequency silicon-on-insulator (RF SOI) foundry business as part of an alliance with Peregrine Semiconductor. As part of the move, Peregrine is entering the RF SOI chip market in an effort to develop lower cost devices.    Peregrine is sampling the first RF switch devices based on its new RF SOI process, dubbed UltraCMOS 10 RF SOI. The 130nm technology... » read more

Uncertainty Increases About What’s Next
By Ed Sperling - 24 Oct, 2013 - Comments: 0

Across the semiconductor industry, there is a lot of talk about what’s next. Lithography advances have stalled, NRE and mask costs are rising, and complexity is exploding. But unlike the 1 micron wall, which was supposed to be impenetrable, there is no single issue holding back progress. Instead, there are lots of them, most with pricey workarounds, but which together become more complicat... » read more

Multi-Beam Begins To Shine
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

After years of R&D and promises, multi-beam electron-beam technology is delayed and late to the market. The technology requires more funding and work than previously thought. And generally, the skepticism is running high for the technology. Finally, however, there is a ray of hope, and some momentum, in multi-beam—at least on the photomask front. Seeking to accelerate its multi-beam te... » read more

Debate Heats Up Over Bigger Glass
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

For more than two decades, photomask makers have been talking about moving to a new and larger mask size, sometimes called “bigger glass” by the industry. Generally, the discussions about “bigger glass” have been all talk and no action. But now, some chipmakers are turning up the volume in the discussions and are pushing for a larger mask size. A larger mask size would require the ph... » read more

Challenges Mount For EUV Masks
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

ASML Holding’s first production-worthy scanners for extreme ultraviolet (EUV) lithography are expected to ship this year, but there are still a number of challenges to bring the technology into high-volume manufacturing. As before, the three main challenges for EUV are the power sources, resists and photomasks. To date, the resists are making progress, while the EUV power sources remain a ... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 10 Oct, 2013 - Comments: 0

Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate marketing at Atrenta; ... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 04 Oct, 2013 - Comments: 0

By Ed Sperling Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate market... » read more

Time To Think
By Ed Sperling - 26 Sep, 2013 - Comments: 0

The semiconductor industry seems to be running place these days—maybe even sprinting in place. At the leading edge of design, companies are still looking at the ramifications of moving to finFETs. The move to a 20nm process with double patterning on 16/14nm finFETs, depending on the foundry, looks like a fairly safe bet for those companies with the volume and the resources to design and de... » read more

The Week In Review: Sept. 23
By Mark LaPedus - 23 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

Litho Roadmap Remains Cloudy
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

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