tag: GlobalFoundries

Where Is 2.5D?
By Ed Sperling - 19 Dec, 2013 - Comments: 3

After nearly five years of concentrated research, development, test chips and characterization, 2.5D remains a possibility for many companies but a reality for very few. So what’s taking so long and why hasn’t all of this hype turned into production runs instead of test chips? Semiconductor Engineering spent the past two months interviewing dozens of people on this subject, from chipmakers ... » read more

Industry Restructures Around Cost
By Ed Sperling - 19 Dec, 2013 - Comments: 1

Talk to any semiconductor executive these days about what’s next for their company and you’ll probably encounter the same perspective—cost will drive future design decisions. Dig a little further, however, and you’ll find no consistent strategy for reducing that cost. While the industry has three very viable solutions for improving the power and performance characteristics of SoCs—... » read more

Manufacturing Bits: Dec. 17
By Mark LaPedus - 17 Dec, 2013 - Comments: 0

Implantable TFETs At the recent IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., a number of companies, R&D organizations and universities described new breakthroughs in perhaps the next big thing in semiconductors--the tunnel field-effect transistor (TFET). Aimed for the 5nm node, TFETs are steep sub-threshold slope transistors that can scale the supply voltages bel... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 13 Dec, 2013 - Comments: 0

Tensions between the U.S. and China are growing. In a research report, Gus Richard, an analyst at Piper Jaffray, said: “The technology sector is being impacted by U.S./Chinese tensions over cybersecurity. The combination of Huawei being blocked from doing business in the United States and the Snowden affair are impacting U.S. tech companies' prospects in China. China’s state-run media ident... » read more

Experts At The Table: MEMS Challenges
By Mark LaPedus - 13 Dec, 2013 - Comments: 1

Semiconductor Engineering sat down to discuss the challenges of MEMS with Rakesh Kumar, senior director of the MEMS program at GlobalFoundries; Tak Tanaka, managing director for Applied Global Services at Applied Materials; Paul Lindner, executive technology director at EV Group; and Alissa M. Fitzgerald, founder and managing member at A.M. Fitzgerald & Associates. SE: What’s happening... » read more

Can Intel Dethrone The Foundry Giants?
By Mark LaPedus - 12 Dec, 2013 - Comments: 3

The leading-edge foundry business isn’t for the faint of heart. It requires deep pockets and sound technology to keep pace in the chip-scaling race. And despite pouring billions of dollars into new fabs and processes, foundries are competing for fewer customers at each node. Given the difficult business conditions, only a handful of vendors can afford to compete in the high-end foundry bus... » read more

2014 CapEx: Memory Is Leading The Way
By Adrienne Downey - 12 Dec, 2013 - Comments: 0

The semiconductor industry is expensive. Billions of dollars are spent every year to keep the fabs running, build new fabs, and push the process technology to greater and greater heights. Billions more will be spent to make 450mm production a reality. In January 2013, Semico predicted that, based on initial indications from some companies, total CapEx would be flat this year. Based on current d... » read more

Challenges Mount In Inspection And Metrology
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Chipmakers are moving full speed ahead toward smaller process nodes, thereby driving up the costs and complexities in chip manufacturing. The migrations also are putting enormous stress on nearly all points of the fab flow, including a critical but unsung part of the business—process control. Process control involves 20 or so different segments in the inspection and metrology arena. Genera... » read more

Experts At The Table: Yield And Reliability Issues With Integrating IP
By Ed Sperling - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of integrating IP in complex SoCs with Juan Rey, senior director of engineering at Mentor Graphics; Kevin Yee, product marketing director for Cadence’s SoC Realization Group; and Mike Gianfagna, vice president of marketing at eSilicon. What follows are excerpts of that conversation. SE: As more pieces are integrated into complex SoCs... » read more

Semiconductor New Equipment Market $32.0 Billion For 2013
By Lara Chamness - 12 Dec, 2013 - Comments: 0

Orders for new equipment slowly improved early on in 2013, with bookings reaching a peak by the second quarter before receding in the third quarter. Over this time, equipment billings, while increasing, were trending below 2012 levels. In October, book-to-bill data from both SEMI and the SEAJ show bookings are increasing once again, and this indicates a stronger fourth quarter for the semico... » read more

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