tag: GlobalFoundries

The Week In Review: Feb. 25
By Ed Sperling - 25 Feb, 2013 - Comments: 0

By Mark LaPedus Is China set to bail out a U.S. government technology darling? Two Chinese automotive companies, Geely and Dongfeng Motor, are reported to have bid between $200 million and $350 million for a majority stake in Fisker, the maker of plug-in hybrid cars. If that happens Fisker—which has $192 million in U.S. federal government loan guarantees—could be headed to China, according... » read more

Good Pattern Flow Ahead For 14, 10nm
By Ann Mutschler - 21 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Given complexity, yield, power and other challenges with leading edge manufacturing, semiconductor foundries increasingly have been forced to require more and more restrictive design rules with each new process node. “They keep adding more design rules and more operations to a particular check to eliminate corner cases where in manufacturing they saw some variant... » read more

Getting Ready For High-Mobility FinFETs
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus The IC industry entered the finFET era in 2011, when Intel leapfrogged the competition and rolled out the newfangled transistor technology at the 22nm node. Intel hopes to ramp up its second-generation finFET devices at 14nm by year’s end, with plans to debut its 11nm technology by 2015. Hoping to close the gap with Intel, silicon foundries are accelerating their efforts t... » read more

Foundry Arms Race Under Way
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus A year ago, chipmakers were reeling from a severe shortage of 28nm foundry capacity, prompting foundries to ramp up their fabs at a staggering pace. At the time, foundries were unable to keep up with huge and unforeseen demand for mobile chips. The shortfall was also caused by low yields and the overall lack of installed 28nm capacity. Today, the 28nm crunch is largely ov... » read more

Optical Lithography, Take Two
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus It’s the worst-kept secret in the industry. Extreme ultraviolet (EUV) lithography has missed the initial stages of the 10nm logic and 1xnm NAND flash nodes. Chipmakers hope to insert EUV by the latter stages of 10nm or by 7nm, but vendors are not counting on EUV in the near term and are preparing their back-up plans. Barring a breakthrough with EUV or other technology, IC ... » read more

Accelerating Moore’s Law
By Ed Sperling - 21 Feb, 2013 - Comments: 0

By Ed Sperling Ever since the inception of Moore’s Law, process nodes have moved forward at a rate of once every 18 to 24 months. Companies have been talking about slowing down the rate of progression as things get harder, but at least for the next couple of process nodes something very strange will occur—Moore’s Law will accelerate. The root cause is growing competition for a shrinki... » read more

The Best Foundry Strategy
By Joanne Itow - 21 Feb, 2013 - Comments: 0

By Joanne Itow Today, foundries supply more than 20% of the silicon used to produce all the semiconductor products sold. The foundry impact has grown from only 10% in 1997 to 24% today. The significance of foundries is even more evident when focused on logic wafers alone. Figure 1. Foundry Wafers as a Percent of Total, IC’s, and IC’s Minus Memory [caption id="attachment_7339" align="... » read more

FinFETs, EUV And Moore’s Law
By Ed Sperling - 21 Feb, 2013 - Comments: 0

GlobalFoundries VP Subramani Kengeri talks about progress and problems with advanced processes with Semiconductor Manufacturing & Design. [youtube vid=_Ang0I1vWdI] » read more

Making The Right Choices
By Ed Sperling - 21 Feb, 2013 - Comments: 0

FD-SOI at 28nm, or finFETs at 20/14nm? To companies looking at the cost equation, the total market opportunity for SoCs and the NRE required to get there, this is still a manageable formula. It requires lots of number crunching and some unknowns, but by the time you get done with the math it still falls within an acceptable margin of error and the choices are relatively simple. For foundries... » read more

SOI Highlights at Common Platform Tech Forum
By Various Writers - 19 Feb, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

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