tag: high-performance computing

Center Stage: The Time For Hybrid Bonding Has Arrived
By Woo Young Han - 07 Jun, 2022 - Comments: 0

When the subject of hybrid bonding is brought up in the industry, the focus is often on how this technique is used to manufacture CMOS image sensors (CIS), an essential device for today’s digital cameras, particularly those found in smartphones. As such, CIS is a common touchpoint given the ubiquity of mobile phones, whether you hold a product from Apple, Samsung, or Huawei in your hands. ... » read more

Choosing The Right Server Interface Architectures For High Performance Computing
By Jerry Lotto - 12 Apr, 2022 - Comments: 0

The largest bulk and cost of a modern high-performance computing (HPC) installation involves the acquisition or provisioning of many identical systems, interconnected by one or more networks, typically Ethernet and/or InfiniBand. Most HPC experts know that there are many choices between different server manufacturers and the options of form factor, CPU, RAM configuration, out of band management... » read more

Analytical Energy Model Parametrized by Workload, Clock Frequency and Number of Active Cores for Share-Memory High-Performance Computing Applications
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

New academic paper from University of Mons (Belgium) and Universidade Federal do Rio Grande do Norte (Brazil). Abstract "Energy consumption is crucial in high-performance computing (HPC), especially to enable the next exascale generation. Hence, modern systems implement various hardware and software features for power management. Nonetheless, due to numerous different implementations, we ca... » read more

SparseP: Towards Efficient Sparse Matrix Vector Multiplication on Real Processing-In-Memory Systems
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Several manufacturers have already started to commercialize near-bank Processing-In-Memory (PIM) architectures. Near-bank PIM architectures place simple cores close to DRAM banks and can yield significant performance and energy improvements in parallel applications by alleviating data access costs. Real PIM systems can provide high levels of parallelism, large aggregate memory bandwi... » read more

Domain-Specific Design Drives EDA Changes
By Ann Mutschler - 03 Jan, 2022 - Comments: 0

The chip design ecosystem is beginning to pivot toward domain-specific architectures, setting off a scramble among tools vendors to simplify and optimize existing tools and methodologies. The move reflects a sharp slowdown in Moore's Law scaling as the best approach for improving performance and reducing power. In its place, chipmakers — which now includes systems companies — are pushing... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

Data Centers On Wheels
By Ann Mutschler - 28 Jun, 2021 - Comments: 2

Automotive architectures are evolving quickly from domain-based to zonal, leveraging the same kind of high-performance computing now found in data centers to make split-second decisions on the road. This is the third major shift in automotive architectures in the past five years, and it's one that centralizes processing using 7nm and 5nm technology, specialized accelerators, high-speed memor... » read more

Geopolitical And Economic Outlook For Chips And Equipment
By Ed Sperling - 17 Jun, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss geopolitical and economic changes and how they affect the chip industry with Jean-Christophe Eloy, CEO of Yole Developpement; Risto Puhakka, president of VLSI Research; Carolyn Evans, chief economist at Intel; Duncan Meldrum, chief economist at Hilltop Economics; and Rozalia Beica, head of the semiconductor business at AT&S... » read more

Shifting Toward Data-Driven Chip Architectures
By Ed Sperling and Ann Mutschler - 16 Jun, 2021 - Comments: 0

An explosion in data is forcing chipmakers to rethink where to process data, which are the best types of processors and memories for different types of data, and how to structure, partition and prioritize the movement of raw and processed data. New chips from systems companies such as Google, Facebook, Alibaba, and IBM all incorporate this approach. So do those developed by vendors like Appl... » read more

Making Lidar More Useful
By Ed Sperling - 07 Jun, 2021 - Comments: 0

Lidar, one of a trio of “vision” technologies slated for cars of the future, is improving both in terms of form and function. Willard Tu, director of automotive at Xilinx, talks with Semiconductor Engineering about different approaches and tradeoffs between cost, compute intensity and resolution, various range and field of view options, and why convolutional neural networks are so important... » read more

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