tag: HPC

The Ethernet Standard: To IP And Beyond
By Jerry Lotto - 13 Jan, 2022 - Comments: 0

Ethernet is ubiquitous—it is the core technology that defines the Internet and serves to connect the world in ways that people could not imagine even one generation ago. HPC clusters are working on solving the most challenging problems facing humanity—and cloud computing is the service hosting many of the application workloads struggling with these questions. While alternative network infra... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Microelectronics And The AI Revolution
By Frank Schirrmeister - 23 Sep, 2021 - Comments: 0

It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Integrated Ethernet PCS And PHY IP For 400G/800G Hyperscale Data Centers
By Priyank Shukla - 09 Sep, 2021 - Comments: 0

Ethernet has become the primary network protocol of choice for the required server-to-server communication in hyperscale data centers, as it allows hyperscalers to disaggregate network switches and install their software operating systems independently. Ethernet enables cost-effective, dense, open switches and networking technologies which reduce cost/power per bit with transistor scaling. Ethe... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Scaling Simulation
By Brian Bailey - 27 May, 2021 - Comments: 1

Without functional simulation the semiconductor industry would not be where it is today, but some people in the industry contend it hasn't received the attention and research it deserves, causing a stagnation in performance. Others disagree, noting that design sizes have increased by orders of magnitude while design times have shrunk, pointing to simulation remaining a suitable tool for the job... » read more

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