tag: IBM

Cryogenic CMOS Becomes Cool
By Brian Bailey - 11 Aug, 2022 - Comments: 1

Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Nanosheet FETs Drive Changes In Metrology And Inspection
By Karen Heyman - 09 Aug, 2022 - Comments: 0

In the Moore’s Law world, it has become a truism that smaller nodes lead to larger problems. As fabs turn to nanosheet transistors, it is becoming increasingly challenging to detect line-edge roughness and other defects due to the depths and opacities of these and other multi-layered structures. As a result, metrology is taking even more of a hybrid approach, with some well-known tools moving... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 29 Jul, 2022 - Comments: 0

Automotive, mobility Advantest installed its first enhanced T5851-STM16G tester of nonvolatile memory express (NVMe) solid-state drives (SSDs) using ball-grid arrays (BGAs) at a major manufacturer of IC memory devices. Anticipating the automotive market will be the largest consumer semiconductor ICs, Advantest designed the test machine to give system-level test coverage of NVMe BGA SSD devices... » read more

Bespoke Silicon Redefines Custom ASICs
By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Week in Review: Design, Low Power
By Marie C. Baca - 22 Jul, 2022 - Comments: 0

Acquisitions Renesas completed its acquisition of Reality Analytics, which specializes in embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial and commercial products. Siemens Digital Industries Software will acquire Zona Technology, which develops aerospace simulation software. Siemens plans to integrate that software into its wXcelerator and Simcenter... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Week in Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 08 Jul, 2022 - Comments: 0

Automotive The European Union plans to approve sales of fully autonomous vehicles by the end of September, according to Politico. The legislative package will allow for the registration and sale of up to 1,500 vehicles per model per year in member countries. Level 4 autonomous vehicles are still in the development stage, but reducing human error in autos is a crucial part of the EU’s goal to... » read more

Security Risks Widen With Commercial Chiplets
By Ed Sperling - 07 Jul, 2022 - Comments: 0

The commercialization of chiplets is expected to increase the number and breadth of attack surfaces in electronic systems, making it harder to keep track of all the hardened IP jammed into a package and to verify its authenticity and robustness against hackers. Until now this has been largely a non-issue, because the only companies using chiplets today — AMD, Intel, and Marvell — interna... » read more

Quantum Computers And CMOS Semiconductors: A Review And Future Predictions
By Michael Hargrove - 16 Jun, 2022 - Comments: 0

With the advent of quantum computing, the need for peripheral fault-tolerant logic control circuitry has reached new heights. In classical computation, the unit of information is a “1” or “0”. In quantum computers, the unit of information is a qubit which can be characterized as a “0”, “1”, or a superposition of both values (known as a “superimposed state”). The control c... » read more

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