tag: IBM

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 May, 2021 - Comments: 0

Chipmakers and OEMs IBM has unveiled what the company says is the world’s first 2nm chip. The device is based on a next-generation transistor architecture called a nanosheet FET. The nanosheet FET is an evolutionary step from finFETs, which is today’s state-of-the-art transistor technology. Targeted for 2024, IBM’s 2nm chip features a novel multi-Vt scheme, a 12nm gate length, and a n... » read more

Week In Review: Design, Low Power
By Jesse Allen - 07 May, 2021 - Comments: 0

Synopsys completed its acquisition of MorethanIP, a provider of Ethernet Digital Controller IP supporting data rates from 10G to 800G. The acquisition adds MAC (Medium Access Controller) and PCS (Physical Coding Sublayer) for 200G/400G and 800G Ethernet to Synopsys’ portfolio. The company also provides Time-Sensitive Networking, Fibre Channel, and Ethernet Switching IP for integration into AS... » read more

Manufacturing Bits: April 27
By Mark LaPedus - 27 Apr, 2021 - Comments: 0

Next-gen neuromorphic computing The European Union (EU) has launched a new project to develop next-generation devices for neuromorphic computing systems. The project, called MeM-Scales, plans to develop a novel class of algorithms, devices, and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems th... » read more

Putting Limits On What AI Systems Can Do
By Ed Sperling - 22 Apr, 2021 - Comments: 0

New techniques and approaches are starting to be applied to AI and machine learning to ensure they function within acceptable parameters, only doing what they're supposed to do. Getting AI/ML/DL systems to work has been one of the biggest leaps in technology in recent years, but understanding how to control and optimize them as they adapt isn't nearly as far along. These systems are generall... » read more

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
By Technical Paper Link - 31 Mar, 2021 - Comments: 0

Abstract: "Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to gui... » read more

Manufacturing Bits: March 30
By Mark LaPedus - 30 Mar, 2021 - Comments: 0

Open access quantum computing Sandia National Laboratories has begun offering an open access program for its quantum computing testbed. Sandia will enable researchers to explore a range of new technologies, such as chemistry, materials science and mathematics, using its so-called Quantum Scientific Computing Open User Testbed (QSCOUT). Quantum computers promise to solve problems that are to... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Chasing After Carbon Nanotube FETs
By Mark LaPedus - 18 Mar, 2021 - Comments: 6

Carbon nanotube transistors are finally making progress for potential use in advanced logic chips after nearly a quarter century in R&D. The question now is whether they will move out of the lab and into the fab. Several government agencies, companies, foundries, and universities over the years have been developing, and are now making advancements with carbon nanotube field-effect transi... » read more

MRAM Evolves In Multiple Directions
By Bryon Moyer - 11 Mar, 2021 - Comments: 1

Magnetoresistive RAM (MRAM) is one of several new non-volatile memory technologies targeting broad commercial availability, but designing MRAM into chips and systems isn't as simple as adding other types of memory. MRAM isn’t an all-things-for-all-applications technology. It needs to be tuned for its intended purpose. MRAMs targeting flash will not do as well targeting SRAMs, and vice vers... » read more

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