tag: Infineon

How Semiconductor Solutions Address Safety Requirements Of Future Power Distribution Networks In Autonomous Vehicles
By Infineon - 13 Oct, 2021 - Comments: 0

Open up the bonnet of any modern automobile and many of us would be hard-pressed to find anything that we could fix ourselves. With pipes and cables almost artistically integrated into the engine bay, and sleek plastic covers fitted everywhere, there is very little that can still be recognized, yet alone repaired. Perhaps the only location where we feel comfortable is the “fuse box”, or pow... » read more

Inspecting, Testing, And Measuring SiC
By Patrick Waurzyniak - 12 Oct, 2021 - Comments: 0

Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Oct, 2021 - Comments: 0

Arteris IP plans to become a public company. It filed a registration statement with the SEC for an IPO, and intends to list on Nasdaq. The number of shares to be offered and the price range for the proposed offering have not yet been determined. Arteris IP provides network-on-chip interconnect IP, cache coherent interconnects, and packages to speed functional safety certification alongside IP d... » read more

Competing Auto Sensor Fusion Approaches
By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

Building A Secured Internet Of Things
By Infineon - 06 Oct, 2021 - Comments: 0

The emerging Internet of Things (IoT) presents tremendous opportunities for innovative companies to deliver products and services to make industry more efficient, transportation safer and the everyday lives of people more convenient and fulfilling. But with great good there also can be great risk. Remote, intelligent monitoring and control for factories, homes, cities, and cars can increase eff... » read more

Overview Of Medical Chip Challenges
By Susan Rambo - 30 Sep, 2021 - Comments: 0

Medical devices are adopting, and increasingly adapting, a variety of semiconductor technologies to provide new functions and capabilities in smaller form factors. In doing so, they are leveraging increasing processing capabilities, lower power, and new types of sensors to propel health care forward. Many different chip types have been used in medical devices for years, many of them develope... » read more

Blog Review: Sept. 22
By Jesse Allen - 22 Sep, 2021 - Comments: 0

Ansys' Tyler Ferris describes some of the many ways electronics on a PCB assembly can fail, from component level failures like wirebond breaking and liftoff to board-level failures such as conductive anodic filament failure. Cadence's Paul McLellan considers the switch from low-speed parallel interfaces to high-speed serial interfaces as one of the key advancements making modern data centers... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Sep, 2021 - Comments: 0

Packaging and test Advantest and PDF Solutions have launched their first jointly developed offering since forming a partnership in 2020. The new product is called the Advantest Cloud Solutions Dynamic Parametric Test (ACS DPT) solution. It integrates PDF Solutions’ Exensio portfolio of data analytics with Advantest’s V93000 Parametric Test System. The ACS DPT solution is designed to op... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Sep, 2021 - Comments: 0

MoSys, a provider of SRAM solutions and networking accelerators, and Peraso Technologies, a provider of 5G mmWave devices, are merging. Stockholders of Peraso are expected to hold a 61% equity interest in the combined company, with the remaining 39% equity interest to be retained by the stockholders of MoSys. Peraso CEO Ronald Glibbery said, "By joining with MoSys, we believe we can deliver a b... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Sep, 2021 - Comments: 0

Automotive Arm announced a new software architecture, two reference hardware implementations, and its role leading a new industry group that will work on open-source software for automotive use. The Scalable Open Architecture for Embedded Edge (SOAFEE) is based on Arm’s Project Cassini and SystemReady, aims to help the automotive industry move to software-defined systems by tackling the comp... » read more

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