tag: Intel

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Mar, 2021 - Comments: 0

Chipmakers Intel has re-entered the foundry business after a failed attempt several years ago. In its new efforts, Intel is establishing a new standalone business unit called Intel Foundry Services. As part of those efforts, Intel has announced plans to build two new fabs in Arizona. This build-out represents an investment of approximately $20 billion. “INTC hosted a strategy update with ... » read more

Waiting For Chiplet Standards
By Brian Bailey - 25 Mar, 2021 - Comments: 2

The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Semiconductor CapEx To Grow 13.0% In 2021
By Adrienne Downey - 23 Mar, 2021 - Comments: 0

Semiconductor capital expenditures grew 9.2% in 2020 to US$112.1 billion. This is $14.1 billion higher than our spring 2020 forecast, and $3.2 billion higher than our fall 2020 forecast. As shown in the graph below, the total 2020 CapEx was $9.4 billion larger than the $102.7 billion spent in 2019. Semico is forecasting 2021 CapEx to reach $127 billion, an increase of 13.0%. Source: Semico... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Mar, 2021 - Comments: 0

Chipmakers and OEMs Micron will cease development of 3D XPoint, a next-generation memory technology. Micron also plans to sell a fab that produces 3D XPoint chips. For some time, Intel and Micron have co-developed 3D XPoint, which is based on phase-change memory technology. Intel sells solid-state storage drives (SSDs) using 3D XPoint. In a fab located in Utah, Micron is producing this memo... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Mar, 2021 - Comments: 0

Tools & IP Codasip unveiled three commercially licensed add-ons to the Western Digital SweRV Core EH1, aiming to allow it to be designed into a wider range of applications. The SweRV Core EH1 is a 32-bit, dual-issue, RISC-V ISA core with a 9-stage pipeline, open-sourced through CHIPS Alliance. The add-ons offer a floating-point unit (FPU) that supports the RISC-V single precision [F] and d... » read more

Tradeoffs To Improve Performance, Lower Power
By Ann Mutschler - 11 Mar, 2021 - Comments: 0

Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Preventing Chips From Burning Up During Test
By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

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