s SerDes Matter In Our Daily Social-Media-Driven Lives

By eSilicon - 28 Nov, 2018 - Comments: 0

Hyper-scalers and service providers are moving from 100GbE to 400GbE Ethernet rates and beyond. Wireline and wireless networks are driving new architectures to support the move from 4G LTE to 5G infrastructure. These transitions are driven by the increasing global IP traffic as the world becomes more connected and digital. At the same time, the decentralization of the cloud and data centers are... » read more

Foundries Prepare For Battle At 22nm

By Mark LaPedus - 19 Nov, 2018 - Comments: 0

After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Containing Design Complexity With POP IP

By Kelvin Low - 16 Nov, 2018 - Comments: 0

About 25 years ago, Carver Mead, one of the pioneers of VLSI design, told a technical audience then grappling with the complexities of quarter-micron design that he could see an evolutionary path to about 130nm, but after that point, the picture blurred. Flash forward to the present and we’re manufacturing SoCs at 7nm, and the output is truly amazing devices powering applications we and Me... » read more

It’s Time For Companies To Embrace IP Management

By Ranjit Adhikary - 12 Nov, 2018 - Comments: 0

Everything is a rat race these days. You can see everyone scurrying around trying to be ahead of everyone else. It is the same wherever you look, be it at schools, at work, at the grocery store, on the roads. Semiconductor companies – big and small alike – are more intent than ever on trying to be the first to get their SoCs into the market. Some are bound by cultures and traditions on ... » read more

Design For Advanced Packaging

By Brian Bailey - 08 Nov, 2018 - Comments: 0

Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 26 Oct, 2018 - Comments: 0

Internet of Things Arm aims to accelerate Linux-based embedded design through providing quick access to the Cortex-A5 CPU under the Arm DesignStart program. Developers can work on embedded and Internet of Things system-on-a-chip devices for gateways, medical systems, smart homes, and wearable electronics. IP access to the Cortex-A5 is now $75,000, with one-year of design support from Arm exper... » read more

The Race To Design Larger Systems

By Ed Sperling - 25 Oct, 2018 - Comments: 0

For more than a decade, tools vendors and design houses have been talking about leveraging their tools and expertise to help design systems of systems. They're finally getting their chance. The basic idea behind this strategy has always been that issues inside any electronic system—performance, power, signal integrity, area—have all been dealt all the way down to the sub-atomic level in ... » read more

Building AI SoCs

By Ed Sperling - 25 Oct, 2018 - Comments: 0

Ron Lowman, strategic marketing manager at Synopsys, looks at where AI is being used and how to develop chips when the algorithms are in a state of almost constant change. That includes what moves to the edge versus the data center, how algorithms are being compressed, and what techniques are being used to speed up these chips and reduce power. https://youtu.be/d32jtdFwpcE ... » read more

Carmakers To Chipmakers: Where’s The Data?

By Ed Sperling And Susan Rambo - 24 Oct, 2018 - Comments: 0

The integration of electronics into increasingly autonomous vehicles isn't going nearly as smoothly as the marketing literature suggests. In fact, it could take years before some of these discrepancies are resolved. The push toward full autonomy certainly hasn't slowed down, but carmakers and the electronics industry are approaching that goal from very different vantage points. Carmakers and... » read more

Adding Safety Into Automotive Design

By Ann Mutschler - 04 Oct, 2018 - Comments: 0

The ISO 26262 spec is a household term for anyone even remotely involved with the automotive industry today. Increasingly, though, it is being used interchangeably with safety-readiness across the entire supply chain. ISO 26262 compliance is a prerequisite for IP and chips used in an increasing number of automotive applications. It applies to systems, software, and to individual products. An... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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