The Rise Of Semiconductor IP Subsystems


The semiconductor IP (SIP) market arose when SIP vendors created IP functions that mirrored those found in the discrete semiconductor market and made those functions available to SoC designers in the form of hard or soft SIP blocks. As the SoC and SIP markets evolved, it was a natural evolution that many discrete SIP functions be converged into larger blocks that mimic system-level functions (i... » read more

Even Standard IP Isn’t Always Standard


Time to market and rising complexity are forcing the use of more third-party IP as well as increasing reuse of internally developed IP. But as more IP is added into SoCs, chipmakers are discovering some interesting things: Not all IP works together as planned, even when it’s well characterized. As with cars, performance and mileage vary greatly depending upon who’s driving—and who’s... » read more

IP Ecosystem Solutions For Complex Systems


At the Semico Impact Conference: Focus on the IP Ecosystem, Mahesh Tirupattur, Executive Vice President, Analog Bits, challenged four panelists to an engaging discussion on their approach to IP Ecosystem Solutions for Complex Systems. Panel participants included Dan Kochpatcharin, Deputy Director, IP Portfolio Management, TSMC; Jason Polychronopoulos, Mentor Graphics; Chris Rowen, Cadence Fello... » read more

From DFM To IFM


For the past decade the bridge between design and manufacturing was called, appropriately enough, design for manufacturing. DFM tools, which by nature cross boundaries of what previously were discrete segments in the semiconductor flow, are now critical for complex designs. They allow design teams to check early in the design process whether chips will yield sufficiently and to incorporate rule... » read more

Paving The Way To 16/14nm


The move to the next stop on the Moore’s Law road map isn’t getting any less expensive or easier, but it is becoming more predictable. Tools and programs are being expanded to address physical effects such as electrostatic discharge (ESD), electromigration and thermal effects from increased current density. Any or all of these three checklist items can affect the reliability of a chip. A... » read more

Atoms, ARMs, ARCs, Andes…And All The Rest


There was a time when nobody believed Intel processors would be replaced with any other device. Intel commanded the processor market. Rich Wawrzyniak, senior analyst for ASIC SoC at Semico Research, noted this was not always the case. In the early days of the PC there were many contenders and most people thought that Motorola would win because they had more money behind them. Ultimately, Intel ... » read more

Arteris Sells Some Of Its IP Assets To Qualcomm


Qualcomm agreed to buy Arteris’ NoC technology IP and hire some of the engineers who built it, but Arteris will continue to service that IP to new and existing customers. Under terms of the agreement, the two companies also have agreed upon a roadmap for future deliverables of the IP as well as an engineering support contract. Arteris retains the source code for the FlexNoC interconnect IP pr... » read more

Week In Review: System-Level Design


Mentor Graphics unveiled an embedded hypervisor for automotive infotainment systems. This is a Type 1 hypervisor, meaning it runs next to the metal and below the OS. In contrast, Type 2 hypervisors run above the OS. Mentor’s hypervisor supports multicore processors and ARM’s TrustZone security. Synopsys rolled out Ethernet controller IP for the data center, focused on energy efficiency a... » read more

New World Applications And The Role of IP


Electronic devices have evolved from cyclical killer applications to everyday ‘must-have’ tools. Smartphones and tablets are a couple of these ‘must-have’ devices and are already making possible new world applications. Many of these new world applications, including the Internet of Things and mobile health, will be pervasive and promise high semiconductor unit volumes. Semico has identi... » read more

EDA Shows Continued Growth


EDA and IP revenue jumped 3.8% in Q2 to $1.65 billion, up from $1.59 billion in the same period in 2013, spurred by the need for new tools to design, create and verify SoCs using 16/14nm finFETs. Sequentially, the numbers reported by the EDA Consortium were down slightly from Q1, but the four-quarter moving average—considered a more reliable number because tools sales are long-term investm... » read more

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