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The Next New Memories


Several next-generation memory types are ramping up after years of R&D, but there are still more new memories in the research pipeline. Today, several next-generation memories, such as MRAM, phase-change memory (PCM) and ReRAM, are shipping to one degree or another. Some of the next new memories are extensions of these technologies. Others are based on entirely new technologies or involve ar... » read more

HBM2E: The E Stands for Evolutionary


Samsung introduced the first memory products in March that conform to JEDEC’s HBM2E specification, but so far nothing has come to market—a reflection of just how difficult it is to manufacture this memory in volume. Samsung’s new HBM2E (sold under the Flashbolt brand name, versus the older Aquabolt and Flarebolt brands), offers 33% better performance over HBM2 thanks to doubling the de... » read more

DRAM Tradeoffs: Speed Vs. Energy


Semiconductor Engineering sat down to talk about new DRAM options and considerations with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group director for product marketing at Cadence; Graham Allan, senior product marketing manager for DDR PHYs at Synopsys; and Tien Shiah, senior manager for memory marketing at Samsung Electronics. What follows are excerpts of th... » read more

Waiting For Chiplet Interfaces


There aren't many success stories related to chiplets today for a very simple reason—there are few standard interfaces defined for how to connect them. In fact, the only way to use them is to control both sides of the interface with a proprietary interface and protocol. The one exception is the definition of HBM2, which enables large quantities of third-party DRAM to be connected to a logi... » read more

The Importance Of Using The Right DDR SDRAM Memory


Selecting the right memory technology is often the most critical decision for achieving the optimal system performance. Designers continue to add more cores and functionality to their SoCs; however, increasing performance while keeping power consumption low and silicon footprint small remains a vital goal. DDR SDRAMs, DRAMs in short, meet these memory requirements by offering a dense, high-perf... » read more

Week In Review: Design, Low Power


Tools OneSpin unveiled a set of formal apps for development and assessment of RISC-V cores. The RISC-V Integrity Verification Solution formalizes the RISC-V ISA in a set of SystemVerilog Assertions to verify compliance for the ISA is met. It provides a formal bug absence core assessment environment for unbounded proofs and systematic discovery of all hidden instructions or unintended side effe... » read more

Week In Review: Design, Low Power


Gyrfalcon Technology released a 22nm AI accelerator ASIC chip with embedded MRAM. The Lightspeeur 2802M includes 40MB of memory to support large or multiple AI models, such as image classification and voice identification, within a single chip. Manufactured by TSMC, target applications include IoT endpoints, cloud solutions, and autonomous vehicles. Arm expanded its line of automotive-focuse... » read more

Safety, Security And PPA Tradeoffs


Safety and security are emerging as key design tradeoffs as chips are added into safety-critical markets, adding even more complexity into an already complicated optimization process. In the early days of semiconductor design, performance and area were traded off against each other. Then power became important, and the main tradeoffs became power, performance and area (PPA). But as chips inc... » read more

Measuring And Analyzing SoC Performance With Verdi Performance Analyzer


SoC performance is a key competitive advantage in the marketplace. The choice and configuration of SoC components—protocol IP and interconnects, is geared towards maximizing overall SoC performance. A case in point is the use of HBM (High Bandwidth Memory) technology and controllers. Currently in its third generation, HBM boasts high-performance while using less power in a substantially small... » read more

Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

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