Manufacturing Bits: Nov. 21


Germanium-on-mica Germanium is an element that can be used in various applications in electronics, such as optoelectronics, semiconductors and others. For example, silicon-germanium (SiGe), an alloy of silicon and germanium, is used for making RF chips. In future finFET transistors, some are exploring the idea of using pure germanium for the PFET structure to boost the electron mobility in ... » read more

Power/Performance Bits: June 16


Lighting up graphene A team of scientists from Columbia University, Seoul National University, and Korea Research Institute of Standards and Science demonstrated an on-chip visible light source using graphene as a filament. They attached small strips of graphene to metal electrodes, suspended the strips above the substrate, and passed a current through the filaments to cause them to heat up.... » read more

Power/Performance Bits: April 14


Elastic energy harvesting Researchers from the Korea Advanced Institute of Science and Technology (KAIST) and Seoul National University collaborated to develop a hyper-stretchable elastic-composite energy harvesting device. Their stretchable piezoelectric generator can harvest mechanical energy to produce a ~4V power output with around 250% elasticity and a durability over 104 cycles. The... » read more

Manufacturing Bits: Dec. 2


Storage ring EUV source Needless to say, extreme ultraviolet (EUV) lithography is delayed. Chipmakers hope to insert EUV at the 7nm node, but that’s not a given. As before, the big problem is the EUV light source. So far, the source can’t generate enough power to enable the required throughput for EUV in mass production. Researchers at the SLAC National Accelerator Laboratory have one p... » read more

Manufacturing Bits: Sept. 23


The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

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