tag: Kandou Bus

Return Of The Organic Interposer
By Ed Sperling - 06 Aug, 2018 - Comments: 2

Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Advanced Packaging Confusion
By Ed Sperling - 13 Jun, 2018 - Comments: 2

Advanced packaging is exploding in all directions. There are more chipmakers utilizing different packaging options, more options for the packages themselves, and a confusing array of descriptions and names being used for all of these. Several years ago, there were basically two options on the table, 3D-ICs and 2.5D. But as chipmakers began understanding the difficulty, cost and reduced benef... » read more

The Week In Review: Design
By Jesse Allen - 01 Jun, 2018 - Comments: 0

Tools Real Intent launched Verix SimFix, an intent-driven verification solution for gate-level simulation (GLS) of digital designs designed to eliminate X-pessimism. SimFix uses mathematical methods to identify conditions under which pessimism can occur, and to determine the correct value when those conditions occur. It then generates files to use in simulation that detect and correct pessimis... » read more

The Case For Chiplets
By Ed Sperling - 07 May, 2018 - Comments: 4

Discussion about chiplets is growing as the cost of developing chips at 10/7nm and beyond passes well beyond the capabilities of many chipmakers. Estimates for developing 5nm chips (the equivalent 3nm for TSMC and Samsung) are well into the hundreds of millions of dollars just for the NRE costs alone. Masks costs will be in the double-digit millions of dollars even with EUV. And that's assum... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

Mixing Interface Protocols
By Ann Mutschler - 21 Dec, 2017 - Comments: 0

Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

The Week In Review: Design/IoT
By Jesse Allen - 29 Jan, 2016 - Comments: 0

Mergers & Acquisitions Rambus expanded the scope of its Cryptography Research Division with the acquisition of UK-based Smart Card Software. The £64.7M ($91.84 million) deal comprises advanced mobile payment platform developer Bell ID as well as Ecebs, a supplier of smart ticketing systems to the UK transport markets. Tools & IP Mentor Graphics uncorked its Embedded Multicore ... » read more

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