Manufacturing Bits: Nov. 29

By Mark LaPedus - 29 Nov, 2016 - Comments: 0

Supersonic kinetic spraying Low-cost flexible electronics could enable a new class of products, such as roll-up displays, wearable electronics, flexible solar cells and electronic skin. There is a major barrier to enable these technologies, however. The problem is to make flexible transparent conducting films that are scalable and economical. The University of Illinois at Chicago and Kor... » read more

Device Overlay Method For High-Volume Manufacturing

By KLA - 21 Sep, 2016 - Comments: 0

By Honggoo Lee, Sangjun Hana and Youngsik Kima of SK Hynix; Myoungsoo Kim, of the Department of Semiconductor System Engineering at Korea University; Hoyoung Heo, Sanghuck Jeon and DongSub Choi, KLA-Tencor Korea; and Jeremy Nabeth, Irina Brinster, Bill Pierson, and John C. Robinson of KLA-Tencor. Abstract Advancing technology nodes with smaller process margins require improved photolithogra... » read more

Power/Performance Bits: Sept. 29

By Jesse Allen - 29 Sep, 2015 - Comments: 0

Optical rectenna Engineers at the Georgia Institute of Technology demonstrated the first optical rectenna, a device that combines the functions of an antenna and a rectifier diode to convert light directly into DC current. Based on multiwall carbon nanotubes and tiny rectifiers fabricated onto them, the optical rectennas could provide a new technology for photodetectors that would operate... » read more

Power/Performance Bits: July 28

By Jesse Allen - 28 Jul, 2015 - Comments: 0

Synthesizing graphene on silicon Researchers from Korea University, in Seoul, developed an easy and microelectronics-compatible method to grow graphene and have successfully synthesized wafer-scale (four inches in diameter), high-quality, multi-layer graphene on silicon substrates. The method is based on an ion implantation technique, a process in which ions are accelerated under an electric... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Korea University

Manufacturing Bits: Nov. 29

Device Overlay Method For High-Volume Manufacturing

Power/Performance Bits: Sept. 29

Power/Performance Bits: July 28