tag: Lam Research

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jan, 2020 - Comments: 0

Coronavirus The coronavirus in China has been declared as a global health emergency by the World Health Organization (WHO). The situation appears to be much worse than SARS (severe acute respiratory syndrome), which hit in 2003. Several companies are taking precautionary measures to prevent widespread transmission of coronavirus. For example, ASE has devoted a Web page for the measures it is t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jan, 2020 - Comments: 0

Market research What are the hot chip markets for 2020? IC Insights released its rankings of sales growth rates for each of the 33 IC product categories defined by the World Semiconductor Trade Statistics (WSTS) organization. “After posting the two worst growth rates among all IC product categories in 2019, NAND flash and DRAM are forecast to be among the top three fastest-growing IC segment... » read more

SiC Foundry Business Emerges
By Mark LaPedus - 23 Jan, 2020 - Comments: 1

Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

5/3nm Wars Begin
By Mark LaPedus - 23 Jan, 2020 - Comments: 6

Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond. The decision involves the move to extend today’s finFETs to 3nm, or to implement a new technology called gate-all-around FETs (GAA FETs) at 3nm or 2nm. An evolutionary step f... » read more

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Dec, 2019 - Comments: 0

Fab tools and materials In a blog, David Haynes, managing director of strategic marketing at Lam Research, talks about the IoT and automotive chip markets, which are fabricated at a wide range of technology nodes. Hoya recently made an unsolicited $1.4 billion bid to acquire NuFlare, a supplier of e-beam mask writers and other equipment. Click here for more information. Hoya makes several p... » read more

Blog Review: Dec. 18
By Jesse Allen - 18 Dec, 2019 - Comments: 0

Lam Research's David Haynes finds that taking advances made at 300mm and applying them via upgrades to 200mm equipment is a cost appropriate strategy to quickly improve yield and add capacity. Synopsys' Taylor Armerding looks at which of this year's many data breaches hit corporate wallets the hardest and how the cost of privacy noncompliance is expected to rise with California's CCPA and st... » read more

Blog Review: Dec. 11
By Jesse Allen - 11 Dec, 2019 - Comments: 0

Arm's Urmish Thakker investigates ways to make recurrent neural networks run on resource constrained devices with limited cache and compute resources by reducing the number of RNN computations, without the need to retrain the original RNN model. Mentor's Brent Klingforth digs into the challenges of designing rigid-flex PCBs and how advanced capabilities in modern tools, like awareness of sta... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Dec, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has announced the readiness of its new 22nm process. The process enables new 22nm designs or allows customers to migrate from 28nm to 22nm. UMC’s 22nm maintains its existing 28nm design architectures. UMC's 22nm process features a 10% area reduction, better power-to-performance ratio and enhanced RF capabilities, compared to the company’s 2... » read more

Multi-Patterning EUV Vs. High-NA EUV
By Mark LaPedus - 04 Dec, 2019 - Comments: 4

Foundries are finally in production with EUV lithography at 7nm, but chip customers must now decide whether to implement their next designs using EUV-based multiple patterning at 5nm/3nm or wait for a new single-patterning EUV system at 3nm and beyond. This scenario revolves around ASML’s current extreme ultraviolet (EUV) lithography tool (NXE:3400C) versus a completely new EUV system with... » read more

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