tag: Lam Research

Making Chip Packaging Simpler
By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

Finding Defects In Chips With Machine Learning
By Mark LaPedus - 12 Mar, 2019 - Comments: 7

Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more

Domain Expertise Becoming Essential For Analytics
By Ed Sperling - 12 Mar, 2019 - Comments: 0

Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Blog Review: Feb. 27
By Jesse Allen - 27 Feb, 2019 - Comments: 0

Mentor's Harry Foster checks out the trends in language and library adoption for IC/ASIC designs and finds increased adoption of SystemVerilog for both design and verification while UVM remains the dominant verification methodology. Synopsys' Taylor Armerding chats with Chris Clark of Synopsys and Tim Weisenberger of SAE about the weakest points in automotive security and why it's time to mo... » read more

Engineering Talent Shortage Now Top Risk Factor
By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

In-Memory Vs. Near-Memory Computing
By Mark LaPedus - 21 Feb, 2019 - Comments: 1

New memory-centric chip technologies are emerging that promise to solve the bandwidth bottleneck issues in today’s systems. The idea behind these technologies is to bring the memory closer to the processing tasks to speed up the system. This concept isn’t new and the previous versions of the technology fell short. Moreover, it’s unclear if the new approaches will live up to their billi... » read more

Using Sensor Data To Improve Yield And Uptime
By Ed Sperling - 21 Feb, 2019 - Comments: 2

Semiconductor equipment vendors are starting to add more sensors into their tools in an effort to improve fab uptime and wafer yield, and to reduce cost of ownership and chip failures. Massive amounts of data gleaned from those tools is expected to provide far more detail than in the past about multiple types and sources of variation, including when and where that variation occurred and how,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

Embedded Phase-Change Memory Emerges
By Mark LaPedus - 24 Jan, 2019 - Comments: 3

The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

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