tag: Lam Research

All About Interconnects
By Larry Zhao - 18 Dec, 2017 - Comments: 1

It's well known that advanced chips contain billions of transistors – this is an incredible, mind-blowing fact to be sure – but did you know that large-scale integrated chips (about the size of a fingernail) can contain ~30 miles of interconnect “wires” in stacked levels? These wires function like highways or pipelines to transport electrons, connect transistors and other components to ... » read more

The Next 5 Years Of Chip Technology
By Ed Sperling - 18 Dec, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the future of scaling, the impact of variation, and the introduction of new materials and technologies, with Rick Gottscho, CTO of [getentity id="22820" comment="Lam Research"]; Mark Dougherty, vice president of advanced module engineering at [getentity id="22819" comment="GlobalFoundries"]; David Shortt, technical fellow at [getentity id="22876" co... » read more

Chipmakers Look To New Materials
By Jeff Dorsch - 18 Dec, 2017 - Comments: 1

Graphene, the wonder material rediscovered in 2004, and a host of other two-dimensional materials are gaining ground in manufacturing semiconductors as silicon’s usefulness begins to fade. And while there are a number of compounds in use already, such as gallium arsenide, gallium nitride, and silicon carbide, those materials generally are being confined to specific niche applications. Tran... » read more

Blog Review: Dec. 13
By Jesse Allen - 13 Dec, 2017 - Comments: 0

Mentor's Sherif Hany notes that pattern matching isn't just for litho hotspots anymore, and is increasingly being used in a wide range of early design phase checks, DRC flows, layout retargeting and fixing and DFM checks. Synopsys' Eric Huang explains why USB cables have gotten so short, even though no length is mentioned in the specification. Cadence's Paul McLellan listens in as Jeremy ... » read more

Blog Review: Dec. 6
By Jesse Allen - 06 Dec, 2017 - Comments: 0

Synopsys' Eric Huang examines electromagnetic interference, the Bit Error Rate in USB 3.2 and how different transfer types handle errors. Mentor's Nitin Bhagwath points out several things that can cause DDR signals to behave badly, from excessive ringing to stubs in the channel. Cadence's Paul McLellan listens in as Oski CEO Vigyan Singhal explains the basics of assertion-based verificati... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Nov, 2017 - Comments: 0

Market research For the first time since 1993, the semiconductor industry has a new number one supplier in terms of sales—Samsung. Samsung is forecast to top Intel as the #1 semiconductor supplier in 2017, according to IC Insights. "Samsung first charged into the top spot in 2Q17 and displaced Intel, which had held the number 1 ranking since 1993," according to the firm. "In 1Q16, Intel’s ... » read more

Blog Review: Nov. 22
By Ed Sperling - 22 Nov, 2017 - Comments: 0

ARM's Jem Davies talks about an upcoming documentary on AI and where the lines need to be drawn between machine intelligence and human emotional intelligence. Mentor's Saunder Peng examines the impact of merging physical verification databases, which can cost time and resources, and how that can be streamlined. Cadence's Paul McClellan takes a look back at the Xerox Alto and how it change... » read more

The Next 5 Years Of Semiconductor Technology
By Sandra Liu - 21 Nov, 2017 - Comments: 0

New, advanced semiconductor processing and architectural technologies take years to perfect and put into production. In the meantime, semiconductor customers continue to demand faster, smaller and higher functioning devices. Semiconductor manufacturers need to decide whether (and when) to jump to the next generation of devices and production technologies, weighing the risk and benefit of bringi... » read more

What’s What In Advanced Packaging
By Choon Lee - 16 Nov, 2017 - Comments: 5

Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure protects the fragile integrated circuits inside, as well as dissipates heat, keeps chips isolated from each other, and, importantly, provides connection to the circuit board and other elements. The manufa... » read more

What’s Next For Atomic Layer Etch?
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

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