Leti Looks at Using Strain with FD-SOI for High-Perf Apps

By Various Writers - 29 Jun, 2012 - Comments: 0

The researchers at Leti working on FD-SOI have extremely deep expertise in it. One of the areas they've looked at is performance boosters. With the interest in FD-SOI rapidly increasing on the heels of the recent ST-GF announcement, their work becomes even more timely. A key Leti team wrote a summary of some recent strain work, which first appeared as part of the Advanced Substra... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line

By Various Writers - 12 Mar, 2012 - Comments: 0

The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

CMP, ST et al offer 28nm FD-SOI for prototyping, research

By Various Writers - 06 Nov, 2011 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ What would a port to 28nm FD-SOI do for your design? A recent announcement by CMP, STMicroelectronics and Soitec invites you to find out. Specifically, ST’s CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process – which uses innovative silicon substrates from Soitec and incorporates robust, compact model... » read more

SOI Conference Shows SOI Driving Key Roadmaps

By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

FD-SOI Foundations Ready, Say Semi Execs

By Various Writers - 09 Sep, 2011 - Comments: 0

By Adele Hars SOI (especially fully depleted “FD-SOI”) was a hot topic in the video and audio interviews that Debra Vogler of SST released recently. Here are brief summaries of the most important SOI-related interviews – with top brass from Leti, Soitec, KT, EVG and Qcept – that she made at Semicon West ’11. (If you need a quick backgrounder on FD-SOI basics, see this exp... » read more

RF, MEMS, Photonics Driving 3D Stacking

By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Pallab Chatterjee At Semicon West, a number of the key speakers and TechXPOTs were talking about current products being assembled and shipped with 3D technology. 3D die stacking is no longer a technology of the future. In fact it has been here for many years and has been used in millions, if not billions, of consumer, commercial and high-reliability designs. The two leading technologies ... » read more

MEMS on SOI – Growing Fast and Faster

By Various Writers - 11 Apr, 2011 - Comments: 0

By Adele Hars In the latest ASN posting by Dr. Eric Mounier of Yole Developpement, “SOI for MEMS: A Promising Material”, he notes that SOI MEMS is growing at a CAGR (2011-2015) of 15.6%, compared to 8.1% for bulk silicon-based solutions. MEMS designers are doing amazing things on SOI – which would explain that impressive growth rate. [caption id="attachment_12" align="aligncenter... » read more

The Shape Of Things To Come

By Ed Sperling - 26 Aug, 2010 - Comments: 0

By David Lammers Tall or thin? That is the question facing semiconductor companies, now reaching an “intense” phase in development of the vertical finFET and planar ETSOI (extra thin silicon on insulator) transistors for the 22/20nm and 15/14nm technology generations. “This is a conservative industry,” said Raj Jammy, vice president of materials and emerging technologies at Sematech... » read more

Preparing For 3D IC Stacking

By Ed Sperling - 22 Jul, 2010 - Comments: 0

By David Lammers Through-silicon vias (TSVs) are in various stages of late development, but design and manufacturing challenges remain before companies can gain the full benefits of the third dimension. Two camps are pushing hard to introduce TSVs—the design community and the manufacturing equipment companies. The initial goal is to connect graphics memories to graphics processors in mobi... » read more

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