tag: LVS

Innovative Strategies Are Improving Early Design Circuit Verification
By Raghav Katoch - 24 Sep, 2020 - Comments: 0

Layout vs. schematic (LVS) circuit verification is an essential stage in the integrated circuit (IC) design verification cycle. However, given today’s large design sizes, numerous hierarchies, and complex foundry decks, meeting planned tapeout deadlines in the quickest turnaround time (TAT) can be difficult. In an effort to minimize TAT, most design teams now use parallelized design flows, wh... » read more

Increase LVS Verification Productivity In Early Design Cycles
By Mentor, a Siemens Business - 23 Sep, 2020 - Comments: 0

With the innovative Calibre nmLVS-Recon early verification tool, designers can run targeted short isolation analysis and debugging on blocks, macros and chips in early design phases. The Calibre nmLVS-Recon short isolation use model focuses on fast, efficient, prioritized short isolation and short paths debugging. To read more, click here. » read more

Accelerate Time To Market With Calibre nmLVS-Recon Technology
By Mentor, a Siemens Business - 27 Aug, 2020 - Comments: 0

One thing is clear…tapeouts are getting harder, and taking longer. As part of a growing suite of innovative early-stage design verification technologies, the Calibre nmLVS-Recon tool enables design teams to rapidly examine dirty and immature designs to find and fix high-impact circuit errors earlier and faster, leading to an overall reduction in tapeout schedules and time to market. To rea... » read more

Using Calibre For Advanced IC Packaging Verification And Signoff
By Mentor, a Siemens Business - 10 Jun, 2020 - Comments: 0

As high density advanced package designs evolve and become more common, an automated LVS-like flow to detect and highlight package connectivity errors is required. We explain the most common package verification issues and how designers can resolve them using using Xpedition Substrate Integrator and Calibre 3DSTACK to provide a significant advantage over traditional LVS flows for HDAP. To re... » read more

Reducing IR And EM Issues With Automated Via Insertion
By Mentor, a Siemens Business - 25 Mar, 2020 - Comments: 0

IR drop and EM issues are significant performance and reliability detractors at advanced nodes. Adding vias is the most effective means of correction, but traditional custom scripts are difficult and time-consuming, and do not guarantee correct-by-construction vias. The Calibre YieldEnhancer PowerVia utility uses manufacturing requirements to perform automated insertion of DRC/LVS-clean vias. R... » read more

Moving Beyond Geometries: Context-Aware Verification Improves Design Quality And Reliability
By Sherif Hany - 25 Apr, 2019 - Comments: 0

Context-aware checks integrate physical and electrical information to evaluate a wide range of design conditions, from advanced design rule compliance, to circuit and reliability verification, to design optimization and finishing. Automated context-aware checking provides designers with actionable results that improve both debugging efficiency and verification precision. Introduction Many p... » read more

Connecting Wafer-Level Parasitic Extraction And Netlisting
By Michael Hargrove - 18 Apr, 2019 - Comments: 0

The semiconductor technology simulation world is typically divided into device-level TCAD (technology CAD) and circuit-level compact modeling. Larger EDA companies provide high-level design simulation tools that perform LVS (layout vs. schematic), DRC (design rule checking), and many other software solutions that facilitate the entire design process at the most advanced technology nodes. In thi... » read more

Design For Advanced Packaging
By Brian Bailey - 08 Nov, 2018 - Comments: 0

Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

The Process Design Kit: Protecting Design Know-How
By John Ferguson - 08 Nov, 2018 - Comments: 2

Once upon a time, integrated circuits (ICs) were built by the same companies that designed them. The design of an IC was tightly integrated with the manufacturing processes available within each company. In these days, when designs contained hundreds of transistors, companies modeled each feature in an IC at a first principles level, meaning each transistor or fundamental device was analyzed an... » read more

Physical Verification For Silicon Photonics: Don’t Panic!
By Omar El-Sewefy - 06 Sep, 2018 - Comments: 0

Silicon photonics augments traditional electrical signals in integrated circuits (ICs) with light transmission to speed up data transfer and reduce power consumption. According to MarketsandMarkets, the overall silicon photonics market is worth approximately $774.1M in 2018, and is expected to reach $1,988.2M by 2023, at a CAGR of 20.8% between 2018 and 2023  [1]. Cloud computing is one market... » read more

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