tag: Mentor

What Does Shift Left With Calibre Mean For IC Designers
By Siemens EDA - 27 Sep, 2023 - Comments: 0

Driven by the world’s seemingly insatiable demand for electronics that constantly do more faster, integrated circuit (IC) design companies are continuously seeking ways to profitably deliver products with more functionality, reliability, and performance while reducing time-to-market. To accomplish this, a well-planned shift left strategy can free up critical time and resources in delivery sch... » read more

Blog Review: September 27
By Jesse Allen - 27 Sep, 2023 - Comments: 0

Siemens' Dirk Hartmann examines how a continual improvement in predictive capability processing and algorithms enables the evolution of simulation performance and highlights two areas that underpin most simulation tools. Synopsys' Ian Land, Jason Niatas, and Marc Serughetti note that digital twins can be used from the chip level through sub-systems and up to the system level to examine perfo... » read more

ReRAM Seeks To Replace NOR
By Karen Heyman - 25 Sep, 2023 - Comments: 0

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives continues to grow, particularly in applications such as automotive. Embedded flash has long left designers wishing for better write speeds and lower energy consumption, but as the leading edge of that technology shrunk to 28nm, another problem arose. Manufacturing flash memory at thos... » read more

Blog Review: September 20
By Jesse Allen - 20 Sep, 2023 - Comments: 0

Siemens' Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed. Synopsys' Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together. Cadence's V... » read more

Why Chiplets Don’t Work For All Designs
By Ed Sperling - 20 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

No Hot Products
By Mike Donnelly - 14 Sep, 2023 - Comments: 0

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component manufacturers and their OEM customers increasingly battle thermal design issues. Analog electronic component manufacturers have traditionally provided models in SPICE format so customers can sim... » read more

Managing P/P Tradeoffs With Voltage Droop Gets Trickier
By Ann Mutschler - 14 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about voltage droop/IR drop with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight Technologies; Venkatesh Santhanagopalan, product manager at Movellus; Joe Davis, senior director for Calibre interfaces and mPower EM/IR... » read more

Electro-Thermal Design Breakthrough
By Siemens EDA - 13 Sep, 2023 - Comments: 0

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Blog Review: September 13
By Jesse Allen - 13 Sep, 2023 - Comments: 0

Siemens' Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem. Synopsys' Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center shou... » read more

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