tag: Mentor

Heterogenous Integration Creating New IP Opportunities
By Brian Bailey - 19 Jul, 2022 - Comments: 0

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

Using AI To Speed Up Edge Computing
By John Koon - 19 Jul, 2022 - Comments: 0

AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Data Management Evolves
By Ann Mutschler - 19 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss data management challenges with Jerome Toublanc, business development executive at Ansys; Kam Kittrell, vice president of product management in the Digital & Signoff Group at Cadence; Simon Rance, vice president of marketing at Cliosoft; Rob Conant, vice president of software and ecosystem at Infineon Technologies; and Michael Munsey, senior dir... » read more

Machine Learning Application For Early Power Analysis Accuracy Improvement
By Siemens EDA - 19 Jul, 2022 - Comments: 0

In this paper, we introduce a machine learning (ML) application that accurately estimates the switching power of the cells without needing the SPEF file (SPEF less PA flow). Three ML models (multi-linear regression, random forest and decision tree) were trained and tested on different industrial designs at 7nm technology. They are trained using different cells’ properties available, SPEF, and... » read more

Week in Review: Manufacturing, Test
By Karen Heyman - 15 Jul, 2022 - Comments: 0

Fab capacity STMicroelectronics and GlobalFoundries inked a deal to build a new jointly-operated 300mm fab adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF). The new facility will support several technologies, with a special focus... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Jul, 2022 - Comments: 0

Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Blog Review: July 13
By Jesse Allen - 13 Jul, 2022 - Comments: 0

Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

Software Infrastructure For Silicon Lifecycle Management
By Siemens EDA - 12 Jul, 2022 - Comments: 0

Semiconductor technology continues to deliver higher levels of logic density in the era of nanometer processes. System-on-chip (SoC) teams can deliver even higher functionality when coupled with the massive integration possibilities of three-dimensional integrated circuit (3DIC) architectures. However, this growth must be matched by increases in capabilities and productivity in the collection a... » read more

Finding Frameworks For End-To-End Analytics
By Anne Meixner - 12 Jul, 2022 - Comments: 0

End-to-end analytics can improve yield and ROI on tool purchases, but reaping those benefits will require common data formats, die traceability, an appropriate level of data granularity — and a determination of who owns what data. New standards, guidelines, and consortium efforts are being developed to remove these barriers to data sharing for analytics purposes. But the amount of work req... » read more

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