The Gargantuan 5G Chip Challenge


Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Power/Performance Bits: Nov. 8


Molecular memristor Researchers from National University of Singapore, Indian Association for the Cultivation of Science, University of Limerick, Texas A&M University, and Hewlett Packard Enterprise discovered a molecular memristor for brain-inspired computing. The molecule uses natural asymmetry in its metal-organic bonds to switch between different states, which allows it to perform u... » read more

RF/Microwave Technology Driving The Connected Car


In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

System-In-Package Thrives In The Shadows


IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

40 GHz VCO and Frequency Divider in 28 nm FD-SOI CMOS Technology for Automotive Radar Sensors


Abstract: "This paper presents a 40 GHz voltage-controlled oscillator (VCO) and frequency divider chain fabricated in STMicroelectronics 28 nm ultrathin body and box (UTBB) fully depleted silicon-on-insulator (FD-SOI) complementary metal-oxide–semiconductor (CMOS) process with eight metal layers back-end-of-line (BEOL) option. VCOs architecture is based on an LC-tank with p-type metal-oxide�... » read more

The Search For 5G mmWave Filters


Cellular telephone technology takes advantage of a large number of frequency bands to provide ever-increasing bandwidth for mobile use. Each of those bands needs a filter to keep its signals separate from other bands, but the filter technologies in current use for cellphones may not scale up to the full millimeter-wave (mmWave) range planned for 5G. “MmWave will happen,” said Mike Eddy, ... » read more

RF To Millimeter-Wave Front-End Component Design Trends For 5G Communications


This white paper discusses design challenges and solutions related to the "third wave" of communications, presenting several case studies in which the Cadence AWR Design Environment platform has been used to develop products for 5G and beyond. Examples include a multiband active antenna tuner for cellular internet of things (IoT) machine-type communications (mMTC) applications, a linear power a... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff


System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more

Power/Performance Bits: May 25


5G energy harvesting Researchers at Georgia Institute of Technology propose a way to harvest power for IoT devices using 5G networks. The team's device uses a flexible Rotman lens-based rectifying antenna (rectenna) system capable of millimeter-wave harvesting in the 28-GHz band. “With this innovation, we can have a large antenna, which works at higher frequencies and can receive power fr... » read more

mmWave Chip, Package, And Board Beamforming Solutions


RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

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