tag: Multibeam

Blog Review: June 25
By Ed Sperling - 25 Jun, 2014 - Comments: 0

Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jun, 2014 - Comments: 0

According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

From The Whiteboard: David Lam
By eBeam Initiative - 19 Jun, 2014 - Comments: 1

Multibeam's David Lam looks at changes in semiconductor lithography, how CVD and etch improve pitch resolution that is not attainable using optical lithography, and how e-beam direct-write can finish the job. [youtube vid=2ZCF-o7DXlU] » read more

Multi-beam Sees The Light
By Mark LaPedus - 19 Jun, 2014 - Comments: 2

The multiple-beam electron-beam market is going in two separate directions at once. Multi-beam for photomask writing is set to take off. The other market--multi-beam for direct-write lithography applications—is still in the early stages and remains in flux. In the multi-beam direct-write segment, for example, multiple sources indicate that KLA-Tencor is exiting this market to focus on its ... » read more

Billions And Billions Invested
By Mark LaPedus - 17 Apr, 2014 - Comments: 4

Over the years, next-generation [getkc id="80" kc_name="lithography"] (NGL) has suffered various setbacks and delays. But until recently, the industry basically shrugged its shoulders and expressed relatively little anxiety about the NGL delays. After all, optical lithography was doing the job in the fab and NGL would eventually materialize. Today, however, the mood is different. In fact, th... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

Defective R&D Funding Models
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

For years, the semiconductor equipment industry has been dealing with an R&D funding gap. Here’s the basic problem: Chipmakers demand certain tools for their next-generation processes, but they are not always willing to foot a large percentage of the R&D bill. And so, the equipment vendors develop the tools and assume a large part of R&D funding--and the risks. Fair or unf... » read more

Executive Briefing: Getting Direct On Litho
By Mark LaPedus - 17 Oct, 2013 - Comments: 0

Semiconductor Engineering sat down and talked with David Lam, principal of the David Lam Group, an investment and advisory firm. Lam is also the chairman of Multibeam, a multi-beam equipment startup for direct-write lithography and other applications. He founded Lam Research in 1980 and left as an employee in 1985. He served on Lam Research’s board for five years after that. SE: Multibeam ... » read more

Litho Roadmap Remains Cloudy
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

Wanted: New Metrology Funding Models
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus The shift toward the 20nm node and beyond will require new and major breakthroughs in chip manufacturing. Most of the attention centers around lithography, gate stacks, interconnects, strain engineering and design-for-manufacturing (DFM). Lost in the conversation are two other critical but overlooked pieces in the manufacturing puzzle—wafer inspection and metrology. ... » read more

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