tag: multiple patterning

EUV Mask Readiness Challenges
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

Chipmakers Look Beyond Scaling
By Ed Sperling - 17 May, 2018 - Comments: 1

Gary Patton, CTO of GlobalFoundries, sat down with Semiconductor Engineering to discuss the rollout of EUV, the rising cost of designing chips at the most advanced nodes, and the growing popularity of 22nm planar FD-SOI in a number of markets. What follows are excerpts of that conversation. SE: You've just begun deploying EUV. Are you experiencing any issues? Patton: It's a very complicat... » read more

Exploring New Scaling Approaches
By Mark LaPedus - 19 Oct, 2017 - Comments: 0

At the recent SPIE Photomask Technology + Extreme Ultraviolet Lithography 2017 conference, Semiconductor Engineering sat down to discuss semiconductor technology with Tsu-Jae King Liu, the TSMC Distinguished Professor in Microelectronics in the Department of Electrical Engineering and Computer Sciences at the University of California at Berkeley. More specifically, Liu discussed some of the new... » read more

What Drives SADP BEOL Variability?
By Michael Hargrove - 18 May, 2017 - Comments: 0

Until EUV lithography becomes a reality, multiple patterning technologies such as triple litho-etch (LELELE), self-aligned double patterning (SADP), and self-aligned quadruple patterning (SAQP) are being used to meet the stringent patterning demands of advanced back-end-of-line (BEOL) technologies. For the 7nm technology node, patterning requirements include a metal pitch of 40nm or less. This ... » read more

Following Multiple Patterns
By Mark LaPedus - 16 Mar, 2017 - Comments: 2

The lithography market is in flux. Today, chipmakers plan to extend today’s 193nm immersion lithography and multi-patterning to at least 10nm and 7nm. For the most critical layers, though, it’s unclear if optical lithography can extend beyond 7nm. For that reason, chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm. To get a handle on the state of patterning, S... » read more

Will EUV Kill Multi-Patterning?
By David Abercrombie - 19 Jan, 2017 - Comments: 0

When I first began working on double-patterning (DP) tools back in late 2010, there was already talk that it might be a fruitless, or at a minimum, very short-lived project, as extreme ultraviolet (EUV) lithography was just around the corner and would make all multi-patterning (MP) obsolete. Well, as I begin my seventh year on this project, I can hear echoes of Mark Twain as clearly, the report... » read more

To 10nm And Beyond
By Mark LaPedus - 20 Oct, 2016 - Comments: 0

Hong Hao, senior vice president of the foundry business at Samsung Semiconductor, sat down with Semiconductor Engineering to discuss the future direction of transistors, process technology, lithography and other topics. What follows are excerpts of those conversations. SE: Samsung recently rolled out its 10nm finFET technology. It appears that Samsung is the world’s first company to ship 1... » read more

Partition Lines Growing Fuzzy
By Ed Sperling - 26 Feb, 2015 - Comments: 0

For as long as most semiconductor engineers can remember, chips with discrete functions started out on a printed circuit board, progressed into chip sets when it made sense and eventually were integrated onto the same die. The primary motivations behind this trend were performance and cost—shorter distance, fewer mask layers, less silicon. But this equation has been changing over the past ... » read more

Fab Tool R&D And Ramen Noodles
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

The semiconductor equipment and materials industry has always been a tough business. Over the years, vendors have been under pressure to develop new technologies for a shrinking but demanding customer base. And as a result, many vendors could not keep up, or elected to exit the business, causing a massive shakeout in the industry. It isn’t getting any easier, though. Today, tool and... » read more

Atomic Layer Etch Finally Emerges
By Mark LaPedus - 15 May, 2014 - Comments: 1

The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more

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