Assessing & Simulating Semiconductor Side-Channel or Unintended Data Leakage Vulnerabilities


This research paper titled "Multiphysics Simulation of EM Side-Channels from Silicon Backside with ML-based Auto-POI Identification" from researchers at Ansys, National Taiwan University and Kobe University won the best paper award at IEEE's International Symposium on Hardware Oriented Security and Trust (HOST). The paper presents a new tool "to assess unintended data leakage vulnerabilities... » read more

Technical Paper Round-up: May 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

SOT-MRAM-based CIM architecture for a CNN model


New research paper "In-Memory Computing Architecture for a Convolutional Neural Network Based on Spin Orbit Torque MRAM", from National Taiwan University, Feng Chia University, Chung Yuan Christian University. Abstract "Recently, numerous studies have investigated computing in-memory (CIM) architectures for neural networks to overcome memory bottlenecks. Because of its low delay, high energ... » read more

Solution Processable Pentafluorophenyl EndCapped Dithienothiophene Organic Semiconductors for Hole Transporting Organic Field Effect Transistors


Abstract: "Two solution‐processable organic semiconductors, DFPT‐DTTR (1) and DFPbT‐DTTR (2), composed of pentafluorophenyl (FP) end‐capped 3,5‐dialkyl dithienothiophene (DTTR) core with thiophene (T) or bithiophene (bT) as π‐bridged spacers are developed and investigated for their optical, electrochemical, microstructural, and electrical properties. With more conjugated bithiophe... » read more

Data-driven Scheduling for High-mix and Low-volume Production in Semiconductor Assembly and Testing


Abstract: The objective of this research is to improve scheduling decisions in high-mix low-volume (HMLV) production environments. Unique characteristics of HMLV semiconductor assembly and testing operations include: (1) Diversified Product Lines: To respond to global competition and different customer needs, manufacturers are providing diversified products to different consumers; (2) Unrelate... » read more

Manufacturing Bits: July 14


Complementary FETs At the recent 2020 Symposia on VLSI Technology and Circuits, Imec presented a paper on a 3D complementary field-effect transistor (CFET) made on 300mm wafers. As a demonstration vehicle, Imec showed a CFET based on a 14nm process. Ideally, though, CFETs are next-generation transistors that are targeted for the 1nm node in the future. On the transistor front, chipmaker... » read more

Efficient Spin-Orbit Torque Switching with Non-Epitaxial Chalcogenide Heterostructures


Abstract: "The spin–orbit torques (SOTs) generated from topological insulators (TIs) have gained increasing attention in recent years. These TIs, which are typically formed by epitaxially grown chalcogenides, possess extremely high SOT efficiencies and have great potential to be employed in next-generation spintronics devices. However, epitaxy of these chalcogenides is required to ensure the... » read more

The Week In Review: Design/IoT


IP Sonics released the latest version of the company's flagship NoC, which expands on their interleaved multi-channel technology and includes new layout optimization features for design flows based on modern physical synthesis and place & route tools. Synopsys extended its PCI Express 4.0 IP to support RAS features to help designers ensure data integrity and increase data protection i... » read more

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