Auto Chip Test Getting Harder


Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range of technical and even cultural barriers. Advanced driver assist systems (ADAS) already are the most complex systems by far in modern cars, the best of which hover between Level 2 and Level 3 on the five-step autonomy ladder maintained by the Society of Automotiv... » read more

Week In Review: Manufacturing, Test


Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

Embedded Flash Scaling Limits


Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

FD-SOI Going Mainstream


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Getting To The Self-Driving Car


Realizing the vision of the fully autonomous vehicle is one of the most ambitious research and development initiatives since the Apollo program of the Space Age. While the goal of Apollo was to send a man to the Moon and safely return him to Earth, the goal of self-driving cars is to get a person out from behind the steering wheel and safely convey that person to home, work, a vacation resor... » read more

Blog Review: June 27


Applied Materials' Sundeep Bajikar argues that to realize the full potential of AI, new computing architectures are necessary, otherwise AI will quickly become unaffordable. Synopsys' Iain Singleton considers why it may not always be necessary to start at the reset state during formal verification and how to use abstractions to get a head start on bug hunting. Cadence's Meera Collier look... » read more

Blog Review: June 13


Synopsys' Taylor Armerding looks at what the flaws in OpenPGP and S/MIME encryption means for the IoT and warns that the problems of patching such devices could lead to an increasing chance of security failures. Cadence's Paul McLellan takes a peek at Imec's roadmap to see what the path to 3nm looks like, how nanosheets fit in, and why design and system technology co-optimization is necessar... » read more

Progress And Chaos On Road To Autonomy


Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

Designing Hardware For Security


By Ed Sperling and Kevin Fogarty Cyber criminals are beginning to target weaknesses in hardware to take control of devices, rather than using the hardware as a stepping stone to access to the software. This shift underscores a significant increase in the sophistication of the attackers, as evidenced by the discovery of Spectre and Meltdown by Google Project Zero in 2017 (made public in Ja... » read more

Non-Traditional Chips Gaining Steam


Flexible hybrid electronics are beginning to roll out in the form of medical devices, wearable electronics and even near-field communications tags in retail, setting the stage for a whole new wave of circuit design, manufacturing and packaging that reaches well beyond traditional chips. FHE devices begin with substrates made of ceramics, glass, plastic, polyimide, polymers, polysilicon, stai... » read more

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