Chip Industry Week In Review

By The SE Staff - 22 May, 2026 - Comments: 0

Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Chip Industry Week in Review

By The SE Staff - 15 May, 2026 - Comments: 0

Global The U.S. created a licensing path for Nvidia H200 shipments in January and has since approved sales to 10 Chinese companies, but so far no shipments have been confirmed, reports Reuters. With a looming end-of-year expiration, SIA, SEMI, and other business groups are urging Congress to extend the US semiconductor tax credit and expand it to cover semiconductor design and other act... » read more

Flash Getting Stacked High-Bandwidth Version

By Bryon Moyer - 14 May, 2026 - Comments: 1

Key takeaways: A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later this year, with accelerators featuring it coming out next year. AI inference using modern models requires billions of parameters, and moving them to where they c... » read more

Chip Industry Week in Review

By The SE Staff - 01 May, 2026 - Comments: 0

Advanced nodes and capacity The US Commerce Dept. told IC equipment makers to stop shipments to Hua Hong Group, China's No. 2 chipmaker, in order to protect America's lead, according to Reuters. Global AI competition is causing wafer and packaging shortages, but capacity increases are expected to come online later this year and in 2027 to ease the crunch, according to TrendForce. Leadi... » read more

Chiplet Standards Aim For Plug-n-Play

By Bryon Moyer - 16 Apr, 2026 - Comments: 0

Key Takeaways Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in progress. Existing work covers packaging, a system architecture, various design kits, a universal link layer, and updates to BoW. Today’s chiplets exist in silos. In a ... » read more

Chip Industry Week In Review

By The SE Staff - 10 Apr, 2026 - Comments: 0

Deals, Funding Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processo... » read more

Chip Industry Week In Review

By The SE Staff - 20 Mar, 2026 - Comments: 0

War impacts The Iran War's toll on the chip industry is widening. Over 95% of Taiwan's energy is imported, causing the country to secure alternative sources. Korea is also heavily dependent on energy imports from the Middle East. Shortages of key materials are cropping up everywhere. Helium from Qatar, the second largest producer behind the U.S., is constrained by hostilities in the Per... » read more

Chip Industry Week in Review

By The SE Staff - 05 Dec, 2025 - Comments: 0

Major Deals: Taiwan-based UMC is exploring possible collaboration with Polar Semiconductor for high-volume production of 8-inch wafers at Polar’s expanded Minnesota fab, a move that could provide domestic manufacturing capacity for automotive, data center, consumer, aerospace, and defense customers. Marvell will acquire Celestial AI for $3.25B, adding photonic fabric technology for o... » read more

3DKs: Making Headway On Chiplet Standards

By Laura Peters - 01 Dec, 2025 - Comments: 0

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon cycle is performed in-house. But the industry’s long-term goal of a free and open chiplet marketplace, in which companies of any size can reap the rewards and economies of scale associated with mult... » read more

Chip Industry Week in Review

By The SE Staff - 24 Oct, 2025 - Comments: 0

Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

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tag: Open Compute Project

Chip Industry Week In Review

Chip Industry Week in Review

Flash Getting Stacked High-Bandwidth Version

Chip Industry Week in Review

Chiplet Standards Aim For Plug-n-Play

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week in Review

3DKs: Making Headway On Chiplet Standards

Chip Industry Week in Review

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