tag: OSAT

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

Current And Future Packaging Trends
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

The Need For Open Molded Plastic Packages
By Rosie Medina - 22 Jul, 2021 - Comments: 0

When you need to meet a project or customer deadline, can you count on your outsourced semiconductor assembly and test (OSAT) provider to get you the parts when you need them? If the answer is “no” or “it depends,” you’ll understand the value of having open molded plastic packages – plastic packages with open cavities – readily available for quick-turn assembly. OSATs are v... » read more

Piecing Together Chiplets
By Mark LaPedus - 22 Jul, 2021 - Comments: 3

Several companies are implementing the chiplet model as a means to develop next-generation 3D-like chip designs, but this methodology still has a long way to go before it becomes mainstream for the rest of the industry. It takes several pieces to bring up a 3D chip design using the chiplet model. A few large players have the pieces, though most are proprietary. Others are missing some key co... » read more

Rethinking Business As Usual
By Rosie Medina - 20 May, 2021 - Comments: 0

Few things can snap your priorities into focus like the onset of a pandemic. Our industry is known for its cyclical nature, so adapting to change is not a new concept. But dealing with the challenges posed by COVID-19 has been like nothing any of us have experienced before. QP Technologies has been fortunate to weather the pandemic well – less than 0.05% of our staff has tested positive, w... » read more

Chip Monitoring And Test Collaborate
By Bryon Moyer - 11 May, 2021 - Comments: 0

As on-chip monitoring becomes more prevalent in complex advanced-node ICs, it’s easy to question whether or not it conflicts with conventional silicon testing. It might even supplant such testing in the future. Or alternatively, they could interact, with each supporting the other. “On-chip monitors provide fine-grained observability into effects and issues that are otherwise difficult or... » read more

The Darker Side Of Hybrid Bonding
By Katherine Derbyshire - 17 Dec, 2020 - Comments: 2

With semiconductors, it's often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such as bonding two chips together using a process aimed at maximizing performance. Case in point: CMP for backend of the line metallization in hybrid bonding. While this is a mature process, it doesn't easily translate for ... » read more

Attaching Fibers To Photonic Chips
By Paul McLellan - 10 Dec, 2020 - Comments: 0

Recently, Cadence held its fifth photonics summit, CadenceCONNECT: Photonics Contribution to High-Performance Computing. You can read my earlier posts: Photonic Integration—From Switching to Computing How to Design Photonics If You Don't Have a PhD: iPronics and Ayar Labs The third day was all about how to connect the incoming and outgoing fibers to the photonics chips. I will cov... » read more

Momentum Builds For Advanced Packaging
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

Better Analytics Needed For Assembly
By Anne Meixner - 11 Aug, 2020 - Comments: 0

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That's easier said than done. Assembly operations long have operated on thin profit margins because their tasks were considered easy to manage. Much has changed over the past several years, however. The r... » read more

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