Accelerating Development of Software Defined Vehicles with Virtual ECUs

By Synopsys - 31 May, 2023 - Comments: 0

The automotive industry is going through a revolution. To adapt to new customer demands such as convenience, safety, autonomy, and electrification, the automotive industry is moving to software-driven vehicles. These require new, more powerful electrical/electronic (E/E) architectures and significantly increase the vehicle software content. They also force the industry to move from lengthy deve... » read more

Maintaining Vehicles Of The Future

By proteanTecs - 08 Feb, 2023 - Comments: 0

Driving a scalable, consumer-centric vision in the mobility industry, vehicles of thefuture will always be connected and differentiated by software. Advancements in software, hardware and their interaction are expanding the boundaries of performance, providing the foundation for next-generation cars. But the same technology that will make this vision a reality also presents new challenges. O... » read more

OTA On-Chip Computing That Conquers A Bottleneck In Wired NoC Architectures

By Technical Paper Link - 21 Jun, 2022 - Comments: 0

New research paper titled "Wireless On-Chip Communications for Scalable In-memory Hyperdimensional Computing" from researchers at IBM Research, Zurich Switzerland and Universitat Politecnica de Catalunya, Barcelona, Spain Abstract: "Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hyp... » read more

Using Periodic Calibration Of Antennas to Ensure the Ongoing Performance Of OTA Systems

By Keysight - 23 Mar, 2022 - Comments: 0

Seen or unseen, antennas are essential to virtually every aspect of our connected world. In any over-the-air application—communication, navigation, radar, and so on—signal quality is heavily dependent on the performance of the transmitting and receiving antennas. In addition, when testing any of today’s electronic devices for electromagnetic interference (EMI) and electromagnetic compatib... » read more

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing

By Advantest - 11 Jan, 2022 - Comments: 0

This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

SoC Verification From Pre-Fabrication To The Over-the-Air Update

By OneSpin Solutions - 30 Jun, 2021 - Comments: 0

The recent new of attacks on system infrastructures serves to highlight that hardware vulnerabilities in the supply chain are not only possible but inevitable if proper precautions are ignored. Verification throughout the entire supply chain is necessary to ensure the safety and security of hardware. Starting as early as the pre-fabrication stage, vulnerabilities, if left unchecked, can be an o... » read more

Hybrid System-Level Test For RF SiP

By Koji Miyauchi - 08 Jun, 2021 - Comments: 0

In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

The Good And Bad Of Auto IC Updates

By John Koon - 03 Jun, 2021 - Comments: 0

Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a decade or more. Modern vehicles are full of electronics. In fact, the value of electronic devices used in modern vehicles is expected to double in the next 10 years, growing to $469 billion by 2030... » read more

Testing AiP Modules In High-Volume Production

By Jose Moreira - 11 May, 2021 - Comments: 0

Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more

Merging Verification And Test

By Brian Bailey - 22 Apr, 2021 - Comments: 0

While the disciplines of functional verification and test serve different purposes, their histories were once closely intertwined. Recent safety and security monitoring requirements coupled with capabilities being embedded into devices is bringing them closer together again, but can they successfully cooperate to bring about improvements in both? Getting there may be difficult. Three phases ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

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by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

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by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?