tag: packaging

GDDR6 Drilldown: Applications, Tradeoffs And Specs
By Ed Sperling - 15 Nov, 2019 - Comments: 0

Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

Survival Of The Cheapest?
By Brian Bailey - 26 Sep, 2019 - Comments: 0

We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Silicon Photonics Begins To Make Inroads
By Kevin Fogarty and Ed Sperling - 09 Jul, 2019 - Comments: 1

Integrating photons and electrons on the same die is still a long way off, but advances in packaging and improvements in silicon photonics are making it possible to use optical communication for a variety of new applications. Utilizing light-based communication between chips, or in self-contained modules, ultimately could have a big impact on chip design. Photons moving through waveguides ar... » read more

Playing Into China’s Hands
By Ed Sperling - 13 Jun, 2019 - Comments: 1

The fallout over blacklisting Huawei in particular, and China in general, has set the tone for a nasty global race. But it is almost certain to produce a different result than the proponents of a trade war are expecting. The idea behind tariffs and the blacklisting of Huawei is to starve China of vital technology. So far, the impact has been minimal. Reports from inside of China are equa... » read more

Manufacturing Bits: June 10
By Mark LaPedus - 10 Jun, 2019 - Comments: 1

Predicting warpage in packages At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, there were several papers on ways to predict variation and warpage in IC packages. Advanced packages are prone to unwanted warpage during the process flow. The warpage challenges escalate as the packages become thinner. Warpage in turn can impact yields in IC packages. ... » read more

ECTC Packaging Trends
By Mark LaPedus - 10 Jun, 2019 - Comments: 0

At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

The Precision Knob
By Ed Sperling - 18 Apr, 2019 - Comments: 0

Precision used to be a goal, but increasingly it is being used as a tool. This is true for processing and algorithms, where less precision can greatly improve both performance and battery life. And it is true in manufacturing, where more precision can help minimize the growing impact of variation. Moreover, being able to dial precision up or down can help engineers see the impact on a system... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Finding New Dimensions Of Innovation
By Gary Dagastine - 15 Nov, 2018 - Comments: 0

Whenever a company announces a major strategy shift and restructuring, such as pivoting away from 7nm FinFET technology development, it’s understandable that confusion, uncertainty and misunderstandings may arise. The best way to allay these concerns is to take an objective look at the situation: Demand for chips for the automotive, IoT, mobility and data center/wireless infrastructure mar... » read more

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