tag: packaging

Using Calibre For Advanced IC Packaging Verification And Signoff
By Mentor, a Siemens Business - 10 Jun, 2020 - Comments: 0

As high density advanced package designs evolve and become more common, an automated LVS-like flow to detect and highlight package connectivity errors is required. We explain the most common package verification issues and how designers can resolve them using using Xpedition Substrate Integrator and Calibre 3DSTACK to provide a significant advantage over traditional LVS flows for HDAP. To re... » read more

High-Speed SerDes At 7/5nm
By Ed Sperling - 02 Jun, 2020 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA implications of moving large amounts of data across and around a chip. » read more

The Need for Speed
By Subodh Kulkarni - 01 Jun, 2020 - Comments: 0

We’ve previously identified the convergence occurring between surface mount technologies (SMT), used to connect packaged semiconductor devices on printed circuit boards, and advanced packaging (AP) technologies, in which connections between the semiconductor devices and to the outside world are incorporated in the packaging process using front-end-like, wafer-or panel-based manufacturing proc... » read more

Packaging And Package Design For AI At The Edge
By Andy Heinig - 12 Mar, 2020 - Comments: 0

Industrial applications will acquire significantly more data directly from machines in coming years. To properly handle this increase in data, it must already be prepared at the machine. The data of the individual sensors can be processed, or an initial data merger can take place here at the so-called “edge.” Algorithms and methods from the field of artificial intelligence increasingly a... » read more

Demystifying Mirror Types
By Tyler Lockman - 12 Mar, 2020 - Comments: 0

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP Layout tools have two distinct styles of mirroring which are used in different places. Often, I get questions about what, exactly, those differences are. And even more, why the styles are used for d... » read more

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Into The Cold And Darkness
By Ed Sperling - 12 Dec, 2019 - Comments: 1

The need for speed is limitless. There is far more data to process, and there is competition on a global scale to process it fastest and most efficiently. But how to achieve future revs of improvements will begin to look very different from the past. For one thing, the new criteria for that speed are frequently tied to a fixed or shrinking power budget. This is why many benchmarks these days... » read more

GDDR6 Drilldown: Applications, Tradeoffs And Specs
By Ed Sperling - 15 Nov, 2019 - Comments: 0

Frank Ferro, senior director of product marketing for IP cores at Rambus, drills down on tradeoffs in choosing different DRAM versions, where GDDR6 fits into designs versus other types of DRAM, and how different memories are used in different vertical markets. » read more

Survival Of The Cheapest?
By Brian Bailey - 26 Sep, 2019 - Comments: 0

We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

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