Top Tech Talks Of 2018

By Linda Christensen - 31 Dec, 2018 - Comments: 0

2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Five Rules For Correlating Rule-based And Field Solver Parasitic Extraction Results

By Yousry ElMaghraby - 20 Dec, 2018 - Comments: 0

There comes a time at every foundry and IC design company when it becomes necessary to run a correlation between a rule-based parasitic extraction (PEX) table and a field solver solution. And when that time arrives, there are a few (five, to be precise) details that will help ensure the correlation produces accurate results. But before we get to those, let’s do a quick refresh on PEX techniqu... » read more

The Process Design Kit: Protecting Design Know-How

By John Ferguson - 08 Nov, 2018 - Comments: 2

Once upon a time, integrated circuits (ICs) were built by the same companies that designed them. The design of an IC was tightly integrated with the manufacturing processes available within each company. In these days, when designs contained hundreds of transistors, companies modeled each feature in an IC at a first principles level, meaning each transistor or fundamental device was analyzed an... » read more

3D Extraction Necessities For 5nm And Below

By Ruben Molina - 25 Jan, 2018 - Comments: 0

For most of my career in product marketing I’ve been focused on Static Timing Analysis (STA). It was, and still is, an area with a diverse set of topics including graph based analysis and path based analysis, on-chip variation modeling, delay calculation, evolving library models, etc. During those years I always understood that parasitic extraction was a crucial element of STA and more impo... » read more

Massively Parallel Electrically Aware Design

By Cadence - 26 Oct, 2016 - Comments: 0

In-design verification is opening new opportunities to shorten design cycles and maximize circuit performance. Whereas physical verification has traditionally required a tradeoff between accuracy and performance for larger designs, recent advances in large-scale distributed computing may offer an alternative. Cloud infrastructure needs are pushing the industry toward larger multi-core server ar... » read more

Calibre xACT Parasitic Extraction Supports Signal Integrity At Advanced Nodes

By Mentor, a Siemens Business - 21 Apr, 2016 - Comments: 0

At advanced nodes, signal integrity analysis requires precise characterization, which in turn requires an accurate extracted netlist. Models that handle new impacts on parasitic extraction at advanced nodes, including multi-patterning, finFETs, and resistance and capacitance effects, must be used. Learn how the Calibre xACT extraction tool supports these advanced foundry device models and leadi... » read more

Next-Generation Parasitic Extraction For 16nm And Beyond

By Mentor, a Siemens Business - 21 May, 2015 - Comments: 0

Advanced nodes and innovative process features such as finFET transistors require a leap forward in the performance and accuracy of analysis tools. The new Calibre xACT solution is a high-performance, high-accuracy parasitic extraction tool architected from the top-down for diverse IC design styles at advanced nodes. The Calibre xACT product delivers reference-level accuracy for leading-edge fi... » read more

How To Speed Signoff Extraction By 5X With Next-Generation Extraction Tool

By Cadence - 19 Nov, 2014 - Comments: 0

Parasitic extraction, particularly in the digital world, is becoming an increasingly time-consuming process. Not surprising, considering the explosion in interconnect corners, increasing design sizes and number of parasitics, and complex modeling features at advanced nodes, including FinFETs. This paper discusses capabilities you should have in order to overcome parasitic extraction challenges,... » read more

Advanced Nodes Drive Changing EDA Requirements

By Ann Mutschler - 23 Oct, 2014 - Comments: 0

With new technical requirements of today’s bleeding edge manufacturing processes propelling the ecosystem of semiconductor foundries, EDA tool suppliers and IP developers, work is being done behind the scenes like a well-conducted orchestra to make sure customer designs can flow through a foundry when the time comes. One of the areas in the design process where new processes are felt acute... » read more

The Week In Review: Design

By Ed Sperling - 17 Jul, 2014 - Comments: 0

Tools Cadence unveiled two new tools. The first is a rapid prototyping platform that the company claims will shorten bring-up time by 70%, with 4X improvements in capacity, with IEEE 1801 support for low-power verification through its emulation platform. The second is a single and multi-corner custom/analog extraction tool, which it claims will improve performance by 5X. The tool has been cert... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?