tag: PCBs

New Approaches To Power Decoupling
By Bryon Moyer - 24 Oct, 2024 - Comments: 0

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. Power is a much more important factor than it used to be, especially in the era of AI. “Doing an AI search consumes 10X the power t... » read more

A Guide To Rigid-Flex PCB Design
By Gregory Beers - 18 Jul, 2024 - Comments: 0

In today’s electronics industry, compact, efficient, and versatile PCBs are in high demand. Rigid-flex technology allows engineers to design boards that bend and flex without compromising performance or reliability. Mastering rigid-flex PCB design can be challenging due to its unique requirements. Whether you're an experienced designer expanding your skills or new to the field, this ar... » read more

IC Package Physical Design Best Practices
By Siemens EDA - 15 Feb, 2024 - Comments: 0

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed circuit board (PCB). But today the industry is moving to disaggregation of traditional monolithic SoC functions into chiplets often interfaced with local high-speed memory to avoid silicon reticle limits... » read more

Distribution Of Currents In Via Arrays
By Siemens EDA - 24 May, 2023 - Comments: 0

It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

12 Ways To Elevate Electronic Design Process Using PADS eBook
By Siemens EDA - 07 Dec, 2022 - Comments: 0

When using PADS Professional Premium, designers have access to standard PCB design functionality, such as schematic definition and physical layout, as well previously optional add-on features (now standard) and all of the latest cloud apps, including: Schematic definition: Access to everything you need: Circuit design and simulation, Component selection, library management, and signal integr... » read more

Co-Packaged Optics In The Data Center
By Ed Sperling - 08 Jun, 2022 - Comments: 0

Just because faster Ethernet is added to the data center doesn’t mean existing hardware can utilize it efficiently. Scott Durrant, strategic marketing manager at Synopsys, talks with Semiconductor Engineering about the rapid rollout of faster Ethernet rates, problems in moving data to the front module of the switch and how much energy is required, and what optical technology can bring to the ... » read more

Next Steps For Panel-Level Packaging
By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

PCB And IC Technologies Meet In The Middle
By Bryon Moyer - 12 Oct, 2021 - Comments: 1

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

PCB Design Rules For Wiring And Crosstalk
By Nikhil Grover - 12 Aug, 2021 - Comments: 0

Today’s electronic devices market demands miniaturized printed circuit boards (PCBs) with a multitude of high-speed functions integrated on a single board. This causes the designers to have traces routed very close to each other to optimize packaging and space. This proximity may cause unintentional coupling of electromagnetic fields, a phenomenon which we know by the name of crosstalk (see f... » read more

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