Tape Out On Time With Demand Signoff DRC In P&R

By Siemens EDA - 28 Jul, 2021 - Comments: 0

Physical characteristics of devices have become progressively more complex even as design companies pack more devices on each die. Combining these characteristics with ever more demanding chip power, performance, and area (PPA) goals not only result in increased resource utilization but also challenge existing tools/flows/techniques. Adding on-demand signoff-quality DRC verification inside P&R ... » read more

Signoff DRC In P&R Lets You Get Better Products To Market Faster

By Srinivas Velivala - 27 May, 2021 - Comments: 0

Trust is generally a reflection of quality. You trust someone, be it an individual or a company, because they have, over time, consistently performed high-quality work. You trust a product because your past experience with that product has been positive, or the experiences of lots of other people have been positive. With that said, quality comes in shades and percentages. Most of us will happil... » read more

MaxLinear And Calibre RealTime Digital

By Siemens EDA - 26 May, 2021 - Comments: 0

MaxLinear implemented the Calibre RealTime Digital interface for fast, iterative, signoff DRC checking and fixing during floorplanning and placement. They not only reduce the total of batch DRC iterations, but also eliminate potential late-stage issues during final physical verification signoff that are exponentially harder to fix. Adopting the Calibre RealTime Digital interface enabled MaxLine... » read more

Optimizing Tool Integration Is Essential To Design Success

By James Paris - 22 Dec, 2020 - Comments: 0

By James Paris and Armen Asatryan The relationship between a place and route (P&R) application and the collection of system-on-chip (SoC) design implementation, analysis, and verification methodologies and tools has always been very much a two-way street. The P&R system is the base, if you will, of design implementation—it takes the virtual and makes it physical. However, it is use... » read more

3 Types Of AI Hardware

By Ed Sperling - 20 Jul, 2020 - Comments: 1

As AI chips become more pervasive, three primary approaches are moving to the forefront. Bradley Geden, director of product marketing at Synopsys, looks at how to take advantage of repeatability, what the different flavors look like, the difference between flat and hierarchical design, and what impact black-box arrays have on programmability. » read more

Speeding Up FPGA Development

By Ed Sperling - 28 Feb, 2020 - Comments: 0

Salaheddin Hetalani, field application engineer at OneSpin Solutions, talks about why it’s getting harder to design and debug FPGAs, how much design time can be saved through formal techniques, and why just relying on programmability isn’t the most efficient approach. » read more

Automotive Chip Design Workflow

By Ed Sperling - 17 Feb, 2020 - Comments: 0

Stewart Williams, senior technical marketing manager at Synopsys, talks about the consolidation of chips in a vehicle and the impact of 7/5nm on automotive SoC design, how to trade off power, performance, area and reliability, and how ISO 26262 impacts those variables. » read more

Dealing With ECOs In Complex Designs

By Ed Sperling - 22 Jan, 2020 - Comments: 0

Namsuk Oh, R&D principal engineer at Synopsys, talks about the impact of more corners and engineering change orders, how that needs to be addressed in the flow to close timing, and how dependencies can complicate any changes that are required. » read more

Distributed Design Implementation

By Ed Sperling - 04 Dec, 2019 - Comments: 0

PV Srinivas, group director for R&D at Synopsys, talks about the impact of larger chips and increasing complexity on design productivity, why divide-and-conquer doesn’t work so well anymore, and how to reduce the number of blocks that need to be considered to achieve faster timing closure and quicker time to market. » read more

Visually Assisted Layout In Custom Design

By Ed Sperling - 29 Oct, 2019 - Comments: 0

Avina Verma, group director for R&D in Synopsys’ Design Group, explains why visual feedback and graphical guidance are so critical in complex layouts, particularly for mixed-signal environments. » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: place and route