Next Generation Chip Embedding Technology For High Efficiency Power Modules and Power SiPs

By ASE - 15 Sep, 2022 - Comments: 0

Cost, performance, and package size are some of the key drivers required in the next generation of package interconnect and package structure evolution. Embedding active die into substrates was mainly driven by package miniaturization for communication handheld devices. However, in the case of power modules, miniaturization is not the only driver that enhances the need for embedded die substrat... » read more

Wave Hello To Improved Performance

By Luciana Caminha Afonso - 13 Sep, 2022 - Comments: 0

The International Energy Agency (IEA) estimated that in 2019, approximately 33 percent of all transportation-related CO2 emissions were generated by buses and light to heavy commercial vehicles. Transitioning to electric drives in this sector could clearly have a significant impact on reducing our emissions, but electrifying such demanding vehicles is not an easy task. Many of the concepts... » read more

Meeting Commercial Demands With XM3 Module Platform

By Wolfspeed, a Cree Company - 20 Feb, 2020 - Comments: 0

While silicon carbide (SiC) is still considered a relatively new material in the semiconductor market, it is now used in power circuitry that supports our everyday lifestyle — from the data centers that deliver our emails, to solar power grids that provide energy to offices and homes, to electric cars and trains we use to commute, and in factory equipment and robots that manufacture the goods... » read more

New SiC Power Modules Deliver Greater Power Densities In Smaller Packages Than Si IGBTs

By Wolfspeed, a Cree Company - 16 Oct, 2019 - Comments: 0

With the shift toward electrical power for a wide range of applications, including power generation, energy storage, and transportation, comes the need to build higher performance electrical conversion and control systems to fuel the future of electric-powered systems. To do so, there is a greater demand for more compact, higher power density, and high temperature operating power modules. Un... » read more

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tag: power modules

Next Generation Chip Embedding Technology For High Efficiency Power Modules and Power SiPs

Wave Hello To Improved Performance

Meeting Commercial Demands With XM3 Module Platform

New SiC Power Modules Deliver Greater Power Densities In Smaller Packages Than Si IGBTs

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