tag: Qualcomm

Chiplets Enter The Supercomputer Race
By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Mar, 2022 - Comments: 0

Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Mar, 2022 - Comments: 0

Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 21 Jan, 2022 - Comments: 0

Security Arm shipped a prototype CHERI-enabled Morello processor, SoC, and board, the first products coming from the security Morello research program that aims to make more secure hardware that will block certain common attacks. The first board prototypes are going to testing teams at Google, Microsoft, and other major stakeholders and partners across the industry and academia.  The UKRI (UK... » read more

Automotive Outlook: 2022
By Ann Mutschler - 06 Jan, 2022 - Comments: 0

The auto industry is widening its focus this year, migrating to new architectures that embrace better security, faster data movement, and eventually more manageable costs. The auto industry is facing both short-term and long-term challenges. In the short term, the chip shortage continues to top the list of concerns for the world's automakers. That shortage has delayed new vehicle deliveries,... » read more

Speeding Up Scan-Based Volume Diagnosis
By Bryon Moyer - 07 Dec, 2021 - Comments: 0

In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 03 Dec, 2021 - Comments: 0

Packaging and test Taiwan’s ASE--the world’s largest OSAT--has announced the proposed sale and disposal of equity interests in its subsidiaries, GAPT Holding and ASE (Kun Shan), to Wise Road Capital, a private equity firm based in China. The deal has a value of $1.46 billion. The announcement is related to four ASE assembly and test facilities in China, including Shanghai, Suzhou, Kunsh... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 19 Nov, 2021 - Comments: 0

3D-ICs Samsung Foundry released 3D-IC EDA flows approvals. 3D-ICs, which are the multi-dies stacked together and integrated into a package, are finding use in automotive, high-performance computing, and artificial intelligence systems. Samsung Foundry qualified Cadence’s 2D-to-3D native 3D partitioning flow for 3D-IC design that automates creating a memory-on-logic 3D stacking configuration,... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Reviving The IPO Route For IP Companies
By Ed Sperling - 01 Nov, 2021 - Comments: 0

K. Charles Janac, chairman and CEO of Arteris IP, sat down with Semiconductor Engineering to talk about the company's recent decision to go public, including the benefits and risks of operating as a public IP company. SE: The rule of thumb used to be $20 million in revenue was needed for an IP company to do an IPO at the turn of the Millennium, and then it increased to $40 million about a de... » read more

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