Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility An engine-sensor malfunction in three popular Japanese-versions of the Subaru models has forced the company to suspend production temporarily in Japan, according to Reuters. The sensor in the CB18 engine, found in Japan’s Forester, Outback, and Levor cars, stops the engine from starting and flashes a warning light. In North America, Subaru is adding a wide-angle mono cam... » read more

Increasing Performance With Data Acceleration


Increasing demand for functions that require a relatively high level of acceleration per unit of data is providing a foothold for in-line accelerator cards, which could mean new opportunities for some vendors and a potential threat for others. For years, either CPUs, or CPUs with FPGA accelerators, met most market needs. But the rapid increase in the volume of data everywhere, coupled with t... » read more

Week In Review: Design, Low Power


Synopsys and Juniper Networks are forming a new, separate company that will provide the industry with an open silicon photonics platform that will include integrated lasers, optical amplifiers, and a full suite of photonic components to form a complete solution that will be accessible through a Process Design Kit (PDK). The new company is being formed, in part, from the carve-out of integrated ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Qualcomm completed its acquisition of Arriver Business from SSW Partners. Arriver’s Driver Assistance, Computer Vision, and Drive Policy assets will become part of the Snapdragon Ride Platform. SSW Partners, a New York-based investment partnership, has acquired all shares in Veoneer, retaining its Tier-1 supplier and integrator businesses. Hyundai Motor Group gave Inf... » read more

Chiplets Enter The Supercomputer Race


Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Manufacturing, Test


Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

Week In Review: Design, Low Power


Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Arm shipped a prototype CHERI-enabled Morello processor, SoC, and board, the first products coming from the security Morello research program that aims to make more secure hardware that will block certain common attacks. The first board prototypes are going to testing teams at Google, Microsoft, and other major stakeholders and partners across the industry and academia.  The UKRI (UK... » read more

Automotive Outlook: 2022


The auto industry is widening its focus this year, migrating to new architectures that embrace better security, faster data movement, and eventually more manageable costs. The auto industry is facing both short-term and long-term challenges. In the short term, the chip shortage continues to top the list of concerns for the world's automakers. That shortage has delayed new vehicle deliveries,... » read more

Speeding Up Scan-Based Volume Diagnosis


In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

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