Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Chip Industry Technical Paper Roundup: May 7


New technical papers added to Semiconductor Engineering’s library this week. [table id=223 /] More ReadingTechnical Paper Library home » read more

Voltage Reference Architectures For Harsh Environments: Quantum Computing And Space


A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL). Abstract: "This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in ... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Forward Body Biasing in Bulk Cryo-CMOS With Negligible Leakage (TU Delft)


A new technical paper titled "Cryogenic-Aware Forward Body Biasing in Bulk CMOS" was published by researchers at QuTech, Tu Delft. Abstract "Cryogenic CMOS (cryo-CMOS) circuits are often hindered by the cryogenic threshold-voltage increase. To mitigate such an increase, a forward body biasing (FBB) technique in bulk CMOS is proposed, which can operate up to the nominal supply without prob... » read more

Research Bits: May 30


Improving qubits Researchers from QuTech say they have improved the ‘Andreev spin qubit’ by taking the two most promising qubits — the spin qubits in semiconductors and transmon qubits in superconducting circuits — and finding a hybrid way that uses the best of both qubit types. “Spin qubits are small and compatible with current industrial technology, but they struggle with interact... » read more

Chip Industry’s Technical Paper Roundup: Oct. 4


New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Technical Paper Round-up: May 31


New technical papers added to Semiconductor Engineering’s library this week. [table id=30 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

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