tag: Rambus

Blog Review: Aug. 23
By Jesse Allen - 23 Aug, 2023 - Comments: 0

Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Processor Tradeoffs For AI Workloads
By Ann Mutschler - 10 Aug, 2023 - Comments: 0

AI is forcing fundamental shifts in chips used in data centers and in the tools used to design them, but it also is creating gaps between the speed at which that technology advances and the demands from customers. These shifts started gradually, but they have accelerated and multiplied over the past year with the rollout of ChatGPT and other large language models. There is suddenly much more... » read more

Using A Retimer To Extend Reach For PCIe 6.0 Designs
By Lou Ternullo - 10 Aug, 2023 - Comments: 0

One of the biggest changes that came with PCIe 6.0 was the transition from non-return-to-zero (NRZ) signaling to PAM4 signaling. Pulse Amplitude Modulation (PAM) enables more bits to be transmitted at the same time on a serial channel. In PCIe 6.0, this translates to 2 bits per clock cycle for 4 amplitude levels (00, 01, 10, 11) vs. PCIe 5.0, and earlier generations, which used NRZ with 1 bit p... » read more

MRAM Getting More Attention At Smallest Nodes
By Karen Heyman - 10 Aug, 2023 - Comments: 2

Magneto-resistive RAM (MRAM) appears to be gaining traction at the most advanced nodes, in part because of recent improvements in the memory itself and in part because new markets require solutions for which MRAM may be uniquely qualified. There are still plenty of skeptics when it comes to MRAM, and lots of potential competitors. That has limited MRAM to a niche role over the past couple de... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

What It Takes To Make An SoC Design Quantum Safe
By Bart Stevens - 03 Aug, 2023 - Comments: 0

When it comes to quantum computing attacks, the first question people ask is “will my design be impacted?” In the majority of cases, the answer is yes. For any device that cannot function with manually programmed symmetric keys, which is most devices, you must plan to make upgrades. The good news is that your architecture is not impacted. Secure domains remain secure domains and keys can be... » read more

RT-600 Root Of Trust Series: A New Generation of Security Anchored In Hardware
By Rambus - 02 Aug, 2023 - Comments: 0

This latest generation of the Rambus RT-600 Root of Trust IP offers many new features designed to support the security needs of customers today and into the future. These features include Quantum Safe Cryptography, Caliptra Root of Trust for Measurement (RoTM) emulation, an embedded physical unclonable function (PUF), as well as many architectural improvements, such as larger memory space and 6... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Improving Performance And Lowering Power In Automotive
By Ann Mutschler - 20 Jul, 2023 - Comments: 0

Automotive OEMs are boosting their investments across the semiconductor ecosystem as stepping stones toward electrification and autonomy, and they are starting to encounter some of the same issues chipmakers have been wrestling with at advanced nodes — massive compute performance, thermal and power issues, reliability over extended lifetimes, and a highly diverse and geographically distribute... » read more

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